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2.5 VOLT HIGH-SPEED TeraSyncTM FIFO 36-BIT CONFIGURATIONS
1,024 x 36, 2,048 x 36, 4,096 x 36, 8,192 x 36, 16,384 x 36, 32,768 x 36, 65,536 x 36, 131,072 x 36 and 262,144 x 36
IDT72T3645, IDT72T3655, IDT72T3665, IDT72T3675, IDT72T3685, IDT72T3695, IDT72T36105, IDT72T36115, IDT72T36125
FEATURES:
*
* * * * * * * * * * * *
Choose among the following memory organizations: IDT72T3645 1,024 x 36 IDT72T3655 2,048 x 36 IDT72T3665 4,096 x 36 IDT72T3675 8,192 x 36 IDT72T3685 16,384 x 36 IDT72T3695 32,768 x 36 IDT72T36105 65,536 x 36 IDT72T36115 131,072 x 36 IDT72T36125 262,144 x 36 Up to 225 MHz Operation of Clocks User selectable HSTL/LVTTL Input and/or Output 2.5V LVTTL or 1.8V, 1.5V HSTL Port Selectable Input/Ouput voltage 3.3V Input tolerant Read Enable & Read Clock Echo outputs aid high speed operation User selectable Asynchronous read and/or write port timing Mark & Retransmit, resets read pointer to user marked position Write Chip Select (WCS) input enables/disables Write operations Read Chip Select (RCS) synchronous to RCLK Programmable Almost-Empty and Almost-Full flags, each flag can default to one of eight preselected offsets Program programmable flags by either serial or parallel means Selectable synchronous/asynchronous timing modes for Almost-
* *
* * * * * * * * * * * * *
Empty and Almost-Full flags Separate SCLK input for Serial programming of flag offsets User selectable input and output port bus-sizing - x36 in to x36 out - x36 in to x18 out - x36 in to x9 out - x18 in to x36 out - x9 in to x36 out Big-Endian/Little-Endian user selectable byte representation Auto power down minimizes standby power consumption Master Reset clears entire FIFO Partial Reset clears data, but retains programmable settings Empty, Full and Half-Full flags signal FIFO status Select IDT Standard timing (using EF and FF flags) or First Word Fall Through timing (using OR and IR flags) Output enable puts data outputs into high impedance state JTAG port, provided for Boundary Scan function Available in 208-pin (17mm x 17mm) or 240-pin (19mm x 19mm) Plastic Ball Grid Array (PBGA) Easily expandable in depth and width Independent Read and Write Clocks (permit reading and writing simultaneously) High-performance submicron CMOS technology Industrial temperature range (-40C to +85C) is available
LD SEN SCLK
FUNCTIONAL BLOCK DIAGRAM
D0 -Dn (x36, x18 or x9)
WEN WCLK/WR WCS
INPUT REGISTER
OFFSET REGISTER
FF/IR PAF EF/OR PAE HF FWFT/SI PFM FSEL0 FSEL1
ASYW
WRITE CONTROL LOGIC
RAM ARRAY 1,024 x 36, 2,048 x 36 4,096 x 36, 8,192 x 36 16,384 x 36, 32,768 x 36 65,536 x 36, 131,072 x36 262,144 x 36
FLAG LOGIC
WRITE POINTER
BE IP BM IW OW MRS PRS TCK TRST TMS TDO TDI Vref WHSTL RHSTL SHSTL
CONTROL LOGIC BUS CONFIGURATION RESET LOGIC
READ POINTER
OUTPUT REGISTER
READ CONTROL LOGIC
RT MARK ASYR
JTAG CONTROL (BOUNDARY SCAN)
RCLK/RD REN RCS
HSTL I/0 CONTROL
OE
EREN
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Q0 -Qn (x36, x18 or x9)
ERCLK
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The TeraSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES 1
2003 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
SEPTEMBER 2003
DSC-5907/17
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
PIN CONFIGURATION
A1 BALL PAD CORNER
A
WCS SCLK WEN WCLK MRS FWFT/SI PAF FSO SHSTL IP RHSTL PAE EF REN RCLK RT
B
SEN ASYW WHSTL PRS LD FF OW HF FSI BE BM ASYR PFM EREN MARK RCS
C
VREF IW VCC VCC VCC VCC VCC VCC VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ Q35 OE
D
D35 D34 VCC VCC VCC GND GND GND GND GND GND VCC VDDQ VDDQ Q33 Q34
E
D33 D32 VCC VCC VCC VDDQ Q31 Q32
F
D31 D30 VCC GND GND VCC Q29 Q30
G
D29 D28 VCC GND GND GND GND GND GND VCC Q27 Q28
H
D27 D26 VCC GND GND GND GND GND GND VCC Q25 Q26
J
D24 D25 VCC GND GND GND GND GND GND VCC Q23 Q24
K
D22 D23 VCC GND GND GND GND GND GND VCC Q22 Q21
L
D20 D21 VCC GND GND VCC Q20 Q19
M
D18 D19 VCC VCC VCC VDDQ Q18 Q17
N
D16 D17 VCC VCC VCC GND GND GND GND GND GND VCC VDDQ VDDQ Q16 Q15
P
D14 D15 VCC VCC VCC VCC VCC VCC VDDQ VDDQ VDDQ VDDQ VDDQ Q14 Q13 Q12
R
D11 D12 D13 D6 D4 D2 D0 TMS TCK TDO Q0 Q2 Q4 Q6 Q11 Q10
T
D9 D10 D8 D7 D5 D3 D1 TRST TDI ERCLK Q1 Q3 Q5 Q7 Q9 Q8
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16
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IDT72T3645/72T3655/72T3665/72T3675/72T3685/72T3695 Only PBGA: 1mm pitch, 17mm x 17mm (BB208-1, order code: BB) TOP VIEW
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
PIN CONFIGURATION (CONTINUED)
A1 BALL PAD CORNER
A
VCC VCC VCC VCC VCC VCC WCLK PRS GND FF EREN RCLK OE VDDQ VDDQ VDDQ VDDQ VDDQ
B
VCC VCC VCC VCC VCC VCC WEN MRS GND PAF EF REN RCS VDDQ VDDQ VDDQ VDDQ VDDQ
C
VCC VCC VCC VCC VCC VCC WCS LD GND HF PAE MARK RT VDDQ VDDQ VDDQ VDDQ VDDQ
D
VCC VCC VCC FWFT/SI OW FS0 SHSTL FS1 GND BE IP BM RHSTL ASYR PFM VDDQ VDDQ VDDQ
E
VCC VCC VCC GND GND VDDQ VDDQ VDDQ
F
VCC VCC VCC GND GND VDDQ VDDQ VDDQ
G
VCC SEN SCLK WHSTL GND VDDQ VDDQ VDDQ
H
VCC VCC VCC ASYW GND GND GND GND GND VDDQ VDDQ VDDQ
J
VCC VCC VCC VREF GND GND GND GND GND VDDQ VDDQ VDDQ
K
VCC VCC VCC IW GND GND GND GND GND VDDQ VDDQ VDDQ
L
D33 D34 D35 GND GND GND GND GND GND VDDQ Q35 Q34
M
D30 D31 D32 GND GND Q33 Q32 Q31
N
D27 D28 D29 GND GND Q30 Q29 Q28
P
D24 D25 D26 GND GND Q27 Q26 Q25
R
D21 D22 D23 GND GND GND GND GND GND GND GND GND GND GND GND Q24 Q23 Q22
T
D19 D20 D13 D10 D5 D4 D1 TMS TDO GND Q0 Q2 Q3 Q8 Q11 Q14 Q21 Q20
U
D18 D17 D14 D11 D7 D8 D2 TRST TDI GND Q1 Q6 Q5 Q9 Q12 Q15 Q18 Q19
V
VCC D16 D15 D12 D9 D6 D3 D0 TCK GND ERCLK Q4 Q7 Q10 Q13 Q16 Q17 VDDQ
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IDT72T36105/72T36115/72T36125 Only PBGA: 1mm pitch, 19mm x 19mm (BB240-1, order code: BB) TOP VIEW
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
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DESCRIPTION:
The IDT72T3645/72T3655/72T3665/72T3675/72T3685/72T3695/ 72T36105/72T36115/72T36125 are exceptionally deep, extrememly high speed, CMOS First-In-First-Out (FIFO) memories with clocked read and write controls and a flexible Bus-Matching x36/x18/x9 data flow. These FIFOs offer several key user benefits: * Flexible x36/x18/x9 Bus-Matching on both read and write ports * A user selectable MARK location for retransmit * User selectable I/O structure for HSTL or LVTTL * Asynchronous/Synchronous translation on the read or write ports * The first word data latency period, from the time the first word is written to an empty FIFO to the time it can be read, is fixed and short. * High density offerings up to 9 Mbit Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. Each FIFO has a data input port (Dn) and a data output port (Qn), both of which can assume either a 36-bit, 18-bit or a 9-bit width as determined by the state of external control pins Input Width (IW), Output Width (OW), and BusMatching (BM) pin during the Master Reset cycle. The input port can be selected as either a Synchronous (clocked) interface, or Asynchronous interface. During Synchronous operation the input port is controlled by a Write Clock (WCLK) input and a Write Enable (WEN) input. Data present on the Dn data inputs is written into the FIFO on every rising edge of WCLK when WEN is asserted. During Asynchronous operation only the WR input is used to write data into the FIFO. Data is written on a rising edge of WR, the WEN input should be tied to its active state, (LOW). The output port can be selected as either a Synchronous (clocked) interface, or Asynchronous interface. During Synchronous operation the output port is controlled by a Read Clock (RCLK) input and Read Enable (REN) input. Data is read from the FIFO on every rising edge of RCLK when REN is asserted. During Asynchronous operation only the RD input is used to read data from the FIFO. Data is read on a rising edge of RD, the REN input should be tied to its active state, LOW. When Asynchronous operation is selected on the output port the FIFO must be configured for Standard IDT mode, also the RCS should be tied LOW and the OE input used to provide three-state control of the outputs, Qn. The output port can be selected for either 2.5V LVTTL or HSTL operation, this operation is selected by the state of the RHSTL input during a master reset. An Output Enable (OE) input is provided for three-state control of the outputs. A Read Chip Select (RCS) input is also provided, the RCS input is synchronized to the read clock, and also provides three-state control of the Qn data outputs. When RCS is disabled, the data outputs will be high impedance. During Asynchronous operation of the output port, RCS should be enabled, held LOW. Echo Read Enable, EREN and Echo Read Clock, ERCLK outputs are provided. These are outputs from the read port of the FIFO that are required for high speed data communication, to provide tighter synchronization between the data being transmitted from the Qn outputs and the data being received by the input device. Data read from the read port is available on the output bus with respect to EREN and ERCLK, this is very useful when data is being read at high speed. The ERCLK and EREN outputs are non-functional when the Read port is setup for Asynchronous mode. The frequencies of both the RCLK and the WCLK signals may vary from 0 to fMAX with complete independence. There are no restrictions on the frequency of the one clock input with respect to the other. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through (FWFT) mode.
In IDT Standard mode, the first word written to an empty FIFO will not appear on the data output lines unless a specific read operation is performed. A read operation, which consists of activating REN and enabling a rising RCLK edge, will shift the word from internal memory to the data output lines. In FWFT mode, the first word written to an empty FIFO is clocked directly to the data output lines after three transitions of the RCLK signal. A REN does not have to be asserted for accessing the first word. However, subsequent words written to the FIFO do require a LOW on REN for access. The state of the FWFT/SI input during Master Reset determines the timing mode in use. For applications requiring more data storage capacity than a single FIFO can provide, the FWFT timing mode permits depth expansion by chaining FIFOs in series (i.e. the data outputs of one FIFO are connected to the corresponding data inputs of the next). No external logic is required. These FIFOs have five flag pins, EF/OR (Empty Flag or Output Ready), FF/IR (Full Flag or Input Ready), HF (Half-full Flag), PAE (Programmable Almost-Empty flag) and PAF (Programmable Almost-Full flag). The EF and FF functions are selected in IDT Standard mode. The IR and OR functions are selected in FWFT mode. HF, PAE and PAF are always available for use, irrespective of timing mode. PAE and PAF can be programmed independently to switch at any point in memory. Programmable offsets determine the flag switching threshold and can be loaded by two methods: parallel or serial. Eight default offset settings are also provided, so that PAE can be set to switch at a predefined number of locations from the empty boundary and the PAF threshold can also be set at similar predefined values from the full boundary. The default offset values are set during Master Reset by the state of the FSEL0, FSEL1, and LD pins. For serial programming, SEN together with LD on each rising edge of SCLK, are used to load the offset registers via the Serial Input (SI). For parallel programming, WEN together with LD on each rising edge of WCLK, are used to load the offset registers via Dn. REN together with LD on each rising edge of RCLK can be used to read the offsets in parallel from Qn regardless of whether serial or parallel offset loading has been selected. During Master Reset (MRS) the following events occur: the read and write pointers are set to the first location of the FIFO. The FWFT pin selects IDT Standard mode or FWFT mode. The Partial Reset (PRS) also sets the read and write pointers to the first location of the memory. However, the timing mode, programmable flag programming method, and default or programmed offset settings existing before Partial Reset remain unchanged. The flags are updated according to the timing mode and offsets in effect. PRS is useful for resetting a device in mid-operation, when reprogramming programmable flags would be undesirable. It is also possible to select the timing mode of the PAE (Programmable AlmostEmpty flag) and PAF (Programmable Almost-Full flag) outputs. The timing modes can be set to be either asynchronous or synchronous for the PAE and PAF flags. If asynchronous PAE/PAF configuration is selected, the PAE is asserted LOW on the LOW-to-HIGH transition of RCLK. PAE is reset to HIGH on the LOWto-HIGH transition of WCLK. Similarly, the PAF is asserted LOW on the LOWto-HIGH transition of WCLK and PAF is reset to HIGH on the LOW-to-HIGH transition of RCLK. If synchronous PAE/PAF configuration is selected , the PAE is asserted and updated on the rising edge of RCLK only and not WCLK. Similarly, PAF is asserted and updated on the rising edge of WCLK only and not RCLK. The mode desired is configured during MasterReset by the state of the Programmable Flag Mode (PFM) pin.
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
DESCRIPTION (CONTINUED)
This device includes a Retransmit from Mark feature that utilizes two control inputs, MARK and , RT (Retransmit). If the MARK input is enabled with respect to the RCLK, the memory location being read at that point will be marked. Any subsequent retransmit operation, RT goes LOW, will reset the read pointer to this `marked' location. The device can be configured with different input and output bus widths as shown in Table 1. A Big-Endian/Little-Endian data word format is provided. This function is useful when data is written into the FIFO in long word format (x36/x18) and read out of the FIFO in small word (x18/x9) format. If Big-Endian mode is selected, then the most significant byte (word) of the long word written into the FIFO will be read out of the FIFO first, followed by the least significant byte. If Little-Endian format is selected, then the least significant byte of the long word written into the FIFO will be read out first, followed by the most significant byte. The mode desired is configured during master reset by the state of the Big-Endian (BE) pin. See Figure 5 for Bus-Matching Byte Arrangement. The Interspersed/Non-Interspersed Parity (IP) bit function allows the user to select the parity bit in the word loaded into the parallel port (D0-Dn) when programming the flag offsets. If Interspersed Parity mode is selected, then the FIFO will assume that the parity bit is located in bit positions D8, D17, D26 and D35 during the parallel programming of the flag offsets. If Non-Interspersed Parity mode is selected, then D8, D17 and D26 are assumed to be valid bits
and D32, D33, D34 and D35 are ignored. IP mode is selected during Master Reset by the state of the IP input pin. If, at any time, the FIFO is not actively performing an operation, the chip will automatically power down. Once in the power down state, the standby supply current consumption is minimized. Initiating any operation (by activating control inputs) will immediately take the device out of the power down state. Both an Asynchronous Output Enable pin (OE) and Synchronous Read Chip Select pin (RCS) are provided on the FIFO. The Synchronous Read Chip Select is synchronized to the RCLK. Both the output enable and read chip select control the output buffer of the FIFO, causing the buffer to be either HIGH impedance or LOW impedance. A JTAG test port is provided, here the FIFO has fully functional Boundary Scan feature, compliant with IEEE 1449.1 Standard Test Access Port and Boundary Scan Architecture. The TeraSync FIFO has the capability of operating its ports (write and/or read) in either LVTTL or HSTL mode, each ports selection independent of the other. The write port selection is made via WHSTL and the read port selection via RHSTL. An additional input SHSTL is also provided, this allows the user to select HSTL operation for other pins on the device (not associated with the write or read ports). The IDT72T3645/72T3655/72T3665/72T3675/72T3685/72T3695/ 72T36105/72T36115/72T36125 are fabricated using IDT's high speed submicron CMOS technology.
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
PARTIAL RESET (PRS) WRITE CLOCK (WCLK/WR) WRITE ENABLE (WEN) WRITE CHIP SELECT (WCS) LOAD (LD) (x36, x18, x9) DATA IN (D0 - Dn) SERIAL CLOCK (SCLK) SERIAL ENABLE(SEN) FIRST WORD FALL THROUGH/ SERIAL INPUT (FWFT/SI) FULL FLAG/INPUT READY (FF/IR) PROGRAMMABLE ALMOST-FULL (PAF)
MASTER RESET (MRS) READ CLOCK (RCLK/RD) READ ENABLE (REN) OUTPUT ENABLE (OE)
IDT 72T3645 72T3655 72T3665 72T3675 72T3685 72T3695 72T36105 72T36115 72T36125
READ CHIP SELECT (RCS) (x36, x18, x9) DATA OUT (Q0 - Qn) RCLK ECHO, ERCLK REN ECHO, EREN MARK RETRANSMIT (RT) EMPTY FLAG/OUTPUT READY (EF/OR) PROGRAMMABLE ALMOST-EMPTY (PAE) HALF-FULL FLAG (HF) BIG-ENDIAN/LITTLE-ENDIAN (BE) INTERSPERSED/ NON-INTERSPERSED PARITY (IP)
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INPUT WIDTH (IW)
OUTPUT WIDTH (OW) BUSMATCHING (BM)
Figure 1. Single Device Configuration Signal Flow Diagram
TABLE 1 -- BUS-MATCHING CONFIGURATION MODES
BM L H H H H
NOTE: 1. Pin status during Master Reset.
IW L L L H H
OW L L H L H
Write Port Width x36 x36 x36 x18 x9
Read Port Width x36 x18 x9 x36 x36
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
PIN DESCRIPTION
Symbol ASYR
(1)
Name Asynchronous Read Port Asynchronous Write Port Big-Endian/ Little-Endian Bus-Matching
I/O TYPE LVTTL INPUT LVTTL INPUT LVTTL INPUT LVTTL INPUT HSTL-LVTTL INPUT HSTL-LVTTL OUTPUT
Description A HIGH on this input during Master Reset will select Synchronous read operation for the output port. A LOW will select Asynchronous operation. If Asynchronous is selected the FIFO must operate in IDT Standard mode. A HIGH on this input during Master Reset will select Synchronous write operation for the input port. A LOW will select Asynchronous operation. During Master Reset, a LOW on BE will select Big-Endian operation. A HIGH on BE during Master Reset will select Little-Endian format. BM works with IW and OW to select the bus sizes for both write and read ports. See Table 1 for bus size configuration. Data inputs for a 36-, 18- or 9-bit bus. When in 18- or 9-bit mode, the unused input pins should be tied to GND.
ASYW(1) BE(1) BM(1)
D0-D35 Data Inputs EF/OR Empty Flag/ Output Ready
ERCLK RCLK Echo EREN FF/IR Read Enable Echo Full Flag/ Input Ready
FSEL0(1) Flag Select Bit 0 FSEL1(1) Flag Select Bit 1 FWFT/ SI HF IP(1) IW(1) LD First Word Fall Through/Serial In Half-Full Flag Interspersed Parity Input Width Load
MARK MRS
Mark for Retransmit Master Reset
OE OW(1) PAE PAF PFM(1)
Output Enable Output Width Programmable Almost-Empty Flag Programmable Almost-Full Flag Programmable Flag Mode
In the IDT Standard mode, the EF function is selected. EF indicates whether or not the FIFO memory is empty. In FWFT mode, the OR function is selected. OR indicates whether or not there is valid data available at the outputs. HSTL-LVTTL Read clock Echo output, only available when the Read is setup for Synchronous mode. OUTPUT HSTL-LVTTL Read Enable Echo output, only available when the Read is setup for Synchronous mode. OUTPUT HSTL-LVTTL In the IDT Standard mode, the FF function is selected. FF indicates whether or not the FIFO memory is OUTPUT full. In the FWFT mode, the IR function is selected. IR indicates whether or not there is space available for writing to the FIFO memory. LVTTL During Master Reset, this input along with FSEL1 and the LD pin, will select the default offset values for the INPUT programmable flags PAE and PAF. There are up to eight possible settings available. LVTTL During Master Reset, this input along with FSEL0 and the LD pin will select the default offset values for the INPUT programmable flags PAE and PAF. There are up to eight possible settings available. HSTL-LVTTL During Master Reset, selects First Word Fall Through or IDT Standard mode. After Master Reset, this pin INPUT functions as a serial input for loading offset registers. If Asynchronous operation of the read port has been selected then the FIFO must be set-up in IDT Standard mode. HSTL-LVTTL HF indicates whether the FIFO memory is more or less than half-full. OUTPUT LVTTL During Master Reset, a LOW on IP will select Non-Interspersed Parity mode. A HIGH will select Interspersed INPUT Parity mode. LVTTL This pin, along with OW and BM, selects the bus width of the write port. See Table 1 for bus size configuration. INPUT HSTL-LVTTL This is a dual purpose pin. During Master Reset, the state of the LD input along with FSEL0 and FSEL1, INPUT determines one of eight default offset values for the PAE and PAF flags, along with the method by which these offset registers can be programmed, parallel or serial (see Table 2). After Master Reset, this pin enables writing to and reading from the offset registers.THIS PIN MUST BE HIGH AFTER MASTER RESET TO WRITE OR READ DATA TO/FROM THE FIFO MEMORY. HSTL-LVTTL When this pin is asserted the current location of the read pointer will be marked. Any subsequent Retransmit INPUT operation will reset the read pointer to this position. HSTL-LVTTL MRS initializes the read and write pointers to zero and sets the output register to all zeroes. During Master INPUT Reset, the FIFO is configured for either FWFT or IDT Standard mode, Bus-Matching configurations, Synchronous/Asynchronous operation of the read or write port, one of eight programmable flag default settings, serial or parallel programming of the offset settings, Big-Endian/Little-Endian format, zero latency timing mode, interspersed parity, and synchronous versus asynchronous programmable flag timing modes. HSTL-LVTTL OE provides Asynchronous three-state control of the data outputs, Qn. During a Master or Partial Reset the INPUT OE input is the only input that provide High-Impedance control of the data outputs. LVTTL This pin, along with IW and BM, selects the bus width of the read port. See Table 1 for bus size configuration. INPUT HSTL-LVTTL PAE goes LOW if the number of words in the FIFO memory is less than offset n, which is stored in the Empty OUTPUT Offset register. PAE goes HIGH if the number of words in the FIFO memory is greater than or equal to offset n. HSTL-LVTTL PAF goes HIGH if the number of free locations in the FIFO memory is more than offset m, which is stored in the OUTPUT Full Offset register. PAF goes LOW if the number of free locations in the FIFO memory is less than or equal to m. LVTTL During Master Reset, a LOW on PFM will select Asynchronous Programmable flag timing mode. A HIGH on INPUT PFM will select Synchronous Programmable flag timing mode.
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
PIN DESCRIPTION (CONTINUED)
Symbol PRS Name Partial Reset I/O TYPE Description HSTL-LVTTL PRS initializes the read and write pointers to zero and sets the output register to all zeroes. During Partial Reset, INPUT the existing mode (IDT or FWFT), programming method (serial or parallel), and programmable flag settings are all retained. HSTL-LVTTL Data outputs for an 36-, 18- or 9-bit bus. When in 18- or 9-bit mode, any unused output pins should not OUTPUT be connected. Outputs are not 5V tolerant regardless of the state of OE and RCS. HSTL-LVTTL If Synchronous operation of the read port has been selected, when enabled by REN, the rising edge of RCLK INPUT reads data from the FIFO memory and offsets from the programmable registers. If LD is LOW, the values loaded into the offset registers is output on a rising edge of RCLK.If Asynchronous operation of the read port has been selected, a rising edge on RD reads data from the FIFO in an Asynchronous manner. REN should be tied LOW. HSTL-LVTTL RCS provides synchronous control of the read port and output impedance of Qn, synchronous to RCLK. During INPUT a Master Reset or Partial Reset the RCS input is don't care, if OE is LOW the data outputs will be Low-Impedance regardless of RCS. HSTL-LVTTL If Synchronous operation of the read port has been selected, REN enablesRCLK for reading data from the INPUT FIFO memory and offset registers. If Asynchronous operation of the read port has been selected, the REN input should be tied LOW. LVTTL This pin is used to select HSTL or 2.5v LVTTL outputs for the FIFO. If HSTL or eHSTL outputs are INPUT required, this input must be tied HIGH. Otherwise it should be tied LOW. HSTL-LVTTL RT asserted on the rising edge of RCLK initializes the READ pointer to zero, sets the EF flag to LOW (OR to INPUT HIGH in FWFT mode) and doesn't disturb the write pointer, programming method, existing timing mode or programmable flag settings. If a mark has been set via the MARK input pin, then the read pointer will jump to the `mark' location. HSTL-LVTTL A rising edge on SCLK will clock the serial data present on the SI input into the offset registers providing that INPUT SEN is enabled. HSTL-LVTTL SEN enables serial loading of programmable flag offsets. INPUT LVTTL All inputs not associated with the write or read port can be selected for HSTL operation via the SHSTL input. INPUT HSTL-LVTTL Clock input for JTAG function. One of four terminals required by IEEE Standard 1149.1-1990. Test operations INPUT of the device are synchronous to TCK. Data from TMS and TDI are sampled on the rising edge of TCK and outputs change on the falling edge of TCK. If the JTAG function is not used this signal needs to be tied to GND. HSTL-LVTTL One of four terminals required by IEEE Standard 1149.1-1990. During the JTAG boundary scan operation, INPUT test data serially loaded via the TDI on the rising edge of TCK to either the Instruction Register, ID Register and Bypass Register. An internal pull-up resistor forces TDI HIGH if left unconnected. HSTL-LVTTL One of four terminals required by IEEE Standard 1149.1-1990. During the JTAG boundary scan operation, OUTPUT test data serially loaded output via the TDO on the falling edge of TCK from either the Instruction Register, ID Register and Bypass Register. This output is high impedance except when shifting, while in SHIFT-DR and SHIFT-IR controller states. HSTL-LVTTL TMS is a serial input pin. One of four terminals required by IEEE Standard 1149.1-1990. TMS directs the INPUT the device through its TAP controller states. An internal pull-up resistor forces TMS HIGH if left unconnected. HSTL-LVTTL TRST is an asynchronous reset pin for the JTAG controller. The JTAG TAP controller does not automatically INPUT reset upon power-up, thus it must be reset by either this signal or by setting TMS= HIGH for five TCK cycles. If the TAP controller is not properly reset then the FIFO outputs will always be in high-impedance. If the JTAG function is used but the user does not want to use TRST, then TRST can be tied with MRS to ensure proper FIFO operation. If the JTAG function is not used then this signal needs to be tied to GND. HSTL-LVTTL When Synchronous operation of the write port has been selected, WEN enables WCLK for writing data into INPUT theFIFO memory and offset registers. If Asynchronous operation of the write port has been selected, the WEN input should be tied LOW. HSTL-LVTTL The WCS pin can be regarded as a second WEN input, enabling/disabling write operations. INPUT HSTL-LVTTL If Synchronous operation of the write port has been selected, when enabled by WEN, the rising edge of WCLK INPUT writes data into the FIFO. If Asynchronous operation of the write port has been selected, WR writes data into the FIFO on a rising edge in an Asynchronous manner, (WEN should be tied to its active state).
8
Q0-Q35 Data Outputs RCLK/ RD Read Clock/ Read Stobe
RCS REN
Read Chip Select
Read Enable
RHSTL(1) Read Port HSTL Select RT Retransmit
SCLK SEN
Serial Clock Serial Enable
SHSTL System HSTL Select TCK(2) JTAG Clock
TDI(2)
JTAG Test Data Input JTAG Test Data Output
TDO(2)
TMS(2)
JTAG Mode Select
TRST(2) JTAG Reset
WEN WCS WCLK/ WR
Write Enable
Write Chip Select Write Clock/ Write Strobe
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
PIN DESCRIPTION (CONTINUED)
Symbol Name I/O TYPE LVTTL INPUT I I I I Description This pin is used to select HSTL or 2.5V LVTTL inputs for the FIFO. If HSTL inputs are required, this input must be tied HIGH. Otherwise it should be tied LOW. These are Vcc supply inputs and must be connected to the 2.5V supply rail. These are Ground pins an dmust be connected to the GND rail. This is a Voltage Reference input and must be connected to a voltage level determined from the table, "Recommended DC Operating Conditions". This provides the reference voltage when using HSTL class inputs. If HSTL class inputs are not being used, this pin should be tied LOW. This pin should be tied to the desired voltage rail for providing power to the output drivers. WHSTL(1) Write Port HSTL Select Vcc +2.5v Supply GND Ground Pin Vref Reference Voltage VDDQ O/P Rail Voltage
NOTES: 1. Inputs should not change state after Master Reset. 2. These pins are for the JTAG port. Please refer to pages 31-34 and Figures 6-8.
9
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
ABSOLUTE MAXIMUM RATINGS
Symbol VTERM TSTG IOUT Rating Terminal Voltage with respect to GND Storage Temperature DC Output Current Commercial -0.5 to +3.6(2) -55 to +125 -50 to +50 Unit V
CAPACITANCE (TA = +25C, f = 1.0MHz)
Symbol CIN
(2,3)
Parameter(1) Input Capacitance Output Capacitance
Conditions VIN = 0V VOUT = 0V
Max. 10
(3)
Unit pF pF
C
mA
COUT(1,2)
10
NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. Compliant with JEDEC JESD8-5. VCC terminal only.
NOTES: 1. With output deselected, (OE VIH). 2. Characterized values, not currently tested. 3. CIN for Vref is 20pF.
RECOMMENDED DC OPERATING CONDITIONS
Symbol VCC GND VIH Parameter Supply Voltage Supply Voltage Input High Voltage LVTTL eHSTL HSTL LVTTL eHSTL HSTL eHSTL HSTL Min. 2.375 0 1.7 VREF+0.2 VREF+0.2 -0.3 -0.3 -0.3 0.8 0.68 0 -40 Typ. 2.5 0 -- -- -- -- -- -- 0.9 0.75 -- -- Max. 2.625 0 3.45 VDDQ+0.3 VDDQ+0.3 0.7 VREF-0.2 VREF-0.2 1.0 0.9 70 85 Unit V V V V V V V V V V
VIL
Input Low Voltage
VREF(1) TA TA
Voltage Reference Input
Operating Temperature Commercial Operating Temperature Industrial
C C
NOTE: 1. VREF is only required for HSTL or eHSTL inputs. VREF should be tied LOW for LVTTL operation. 2. Outputs are not 3.3V tolerant.
10
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
DC ELECTRICAL CHARACTERISTICS
(Commercial: VCC = 2.5V 0.125V, TA = 0C to +70C;Industrial: VCC = 2.5V 0.125V, TA = -40C to +85C)
Symbol ILI ILO VOH(5) Input Leakage Current Output Leakage Current Output Logic "1" Voltage, IOH = -8 mA IOH = -8 mA IOH = -8 mA IOL = 8 mA IOL = 8 mA IOL = 8 mA @VDDQ = 2.5V 0.125V (LVTTL) @VDDQ = 1.8V 0.1V (eHSTL) @VDDQ = 1.5V 0.1V (HSTL) @VDDQ = 2.5V 0.125V (LVTTL) @VDDQ = 1.8V 0.1V (eHSTL) @VDDQ = 1.5V 0.1V (HSTL) Parameter Min. -10 -10 VDDQ -0.4 VDDQ -0.4 VDDQ -0.4 -- -- -- Max. 10 10 -- -- -- 0.4V 0.4V 0.4V Unit A A V V V V V V
VOL
Output Logic "0" Voltage,
IDT72T3645/72T3655/72T3665/72T3675/72T3685/72T3695
ICC1(1,2) Active VCC Current (VCC = 2.5V) I/O = LVTTL I/O = HSTL I/O = eHSTL I/O = LVTTL I/O = HSTL I/O = eHSTL -- -- -- -- -- -- 40 70 70 10 50 50 mA mA mA mA mA mA
ICC2(1)
Standby VCC Current (VCC = 2.5V)
IDT72T36105/72T36115/72T36125
ICC1(1,2) Active VCC Current (VCC = 2.5V) I/O = LVTTL I/O = HSTL I/O = eHSTL I/O = LVTTL I/O = HSTL I/O = eHSTL -- -- -- -- -- -- 60 90 90 20 70 70 mA mA mA mA mA mA
ICC2(1)
Standby VCC Current (VCC = 2.5V)
NOTES: 1. Both WCLK and RCLK toggling at 20MHz. Data inputs toggling at 10MHz. WCS = HIGH, REN or RCS = HIGH. 2. For the IDT72T36105/72T36115/72T36125, typical ICC1 calculation (with data outputs in Low-Impedance): for LVTTL I/O ICC1 (mA) = 1.3 x fs, fs = WCLK = RCLK frequency (in MHz) for HSTL or eHSTL I/O ICC1 (mA) = 30 + (1.3 x fs), fs = WCLK = RCLK frequency (in MHz) For the IDT72T3645/72T3655/72T3665/72T3675/72T3685/72T3695, typical ICC1 calculation (with data outputs in Low-Impedance): for LVTTL I/O ICC1 (mA) = 0.7mA x fs, fs = WCLK = RCLK frequency (in MHz) for HSTL or eHSTL I/O ICC1 (mA) = 30 + (0.7 x fs), fs = WCLK = RCLK frequency (in MHz). 3. For all devices, typical IDDQ calculation: with data outputs in High-Impedance: IDDQ (mA) = 0.15 x fs, fs = WCLK = RCLK frequency (in MHz) with data outputs in Low-Impedance: IDDQ (mA) = (CL x VDDQ x fs x N)/2000 fs = WCLK = RCLK frequency (in MHz), VDDQ = 2.5V for LVTTL; 1.5V for HSTL; 1.8V for eHSTL, CL = capacitive load (pf), tA = 25C, N = Number of outputs switching. 4. Total Power consumed: PT = (VCC x ICC) + VDDQ x IDDQ). 5. Outputs are not 3.3V tolerant.
11
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
AC ELECTRICAL CHARACTERISTICS(1) -- SYNCHRONOUS TIMING
(Commercial: VCC = 2.5V 5%, TA = 0C to +70C;Industrial: VCC = 2.5V 5%, TA = -40C to +85C)
Commercial IDT72T3645L4-4 IDT72T3655L4-4 IDT72T3665L4-4 IDT72T3675L4-4 IDT72T3685L4-4 IDT72T3695L4-4 IDT72T36105L4-4 IDT72T36115L4-4 IDT72T36125L4-4 Symbol fC tA tCLK tCLKH tCLKL tDS tDH tENS tENH tLDS tLDH tWCSS tWCSH fS tSCLK tSCKH tSCKL tSDS tSDH tSENS tSENH tRS tRSS tHRSS tRSR tRSF tWFF tREF tPAFS tPAES tERCLK tCLKEN tRCSLZ tRCSHZ tSKEW1 tSKEW2 Parameter Clock Cycle Frequency (Synchronous) Data Access Time Clock Cycle Time Clock High Time Clock Low Time Data Setup Time Data Hold Time Enable Setup Time Enable Hold Time Load Setup Time Load Hold Time WCS setup time WCS hold time Clock Cycle Frequency (SCLK) Serial Clock Cycle Serial Clock High Serial Clock Low Serial Data In Setup Serial Data In Hold Serial Enable Setup Serial Enable Hold Reset Pulse Width(2) Reset Setup Time HSTL Reset Setup Time Reset Recovery Time Reset to Flag and Output Time Write Clock to FF or IR Read Clock to EF or OR Write Clock to Synchronous Programmable Almost-Full Flag Read Clock to Synchronous Programmable Almost-Empty Flag RCLK to Echo RCLK output RCLK to Echo REN output RCLK to Active from High-Z(3) RCLK to High-Z(3) Skew time between RCLK and WCLK for EF/OR and FF/IR Skew time between RCLK and WCLK for PAE and PAF Min. -- 0.6 4.44 2.0 2.0 1.2 0.5 1.2 0.5 1.2 0.5 1.2 0.5 -- 100 45 45 15 5 5 5 30 15 4 10 -- -- -- -- -- -- -- -- -- 3.5 4 Max. 225 3.4 -- -- -- -- -- -- -- -- -- -- -- 10 -- -- -- -- -- -- -- -- -- -- -- 10 3.4 3.4 3.4 3.4 3.8 3.4 3.4 3.4 -- -- Com'l & Ind'l IDT72T3645L5 IDT72T3655L5 IDT72T3665L5 IDT72T3675L5 IDT72T3685L5 IDT72T3695L5 IDT72T36105L5 IDT72T36115L5 IDT72T36125L5 Min. -- 0.6 5 2.3 2.3 1.5 0.5 1.5 0.5 1.5 0.5 1.5 0.5 -- 100 45 45 15 5 5 5 30 15 4 10 -- -- -- -- -- -- -- -- -- 4 5 Max. 200 3.6 -- -- -- -- -- -- -- -- -- -- -- 10 -- -- -- -- -- -- -- -- -- -- -- 12 3.6 3.6 3.6 3.6 4 3.6 3.6 3.6 -- -- Commercial IDT72T3645L6-7 IDT72T3645L10 IDT72T3655L6-7 IDT72T3655L10 IDT72T3665L6-7 IDT72T3665L10 IDT72T3675L6-7 IDT72T3675L10 IDT72T3685L6-7 IDT72T3685L10 IDT72T3695L6-7 IDT72T3695L10 IDT72T36105L6-7 IDT72T36105L10 IDT72T36115L6-7 IDT72T36115L10 IDT72T36125L6-7 IDT72T36125L10 Min. -- 0.6 6.7 2.8 2.8 2.0 0.5 2.0 0.5 2.0 0.5 2.0 0.5 -- 100 45 45 15 5 5 5 30 15 4 10 -- -- -- -- -- -- -- -- -- 5 6 Max. 150 3.8 -- -- -- -- -- -- -- -- -- -- -- 10 -- -- -- -- -- -- -- -- -- -- -- 15 3.8 3.8 3.8 3.8 4.3 3.8 3.8 3.8 -- -- Min. 0.6 10 4.5 4.5 3.0 0.5 3.0 0.5 3.0 0.5 3.0 0.5 -- 100 45 45 15 5 5 5 30 15 4 10 -- -- -- -- -- -- -- -- -- 7 8 Max. 100 4.5 -- -- -- -- -- -- -- -- -- -- -- 10 -- -- -- -- -- -- -- -- -- -- -- 15 4.5 4.5 4.5 4.5 5 4.5 4.5 4.5 -- -- Unit MHz ns ns ns ns ns ns ns ns ns ns ns ns MHz ns ns ns ns ns ns ns ns ns s ns ns ns ns ns ns ns ns ns ns ns ns
NOTES: 1. All AC timings apply to both Standard IDT mode and First Word Fall Through mode. 2. Pulse widths less than minimum values are not allowed. 3. Values guaranteed by design, not currently tested. 4. Industrial temperature range product for the 5ns speed grade is available as a standard device. All other speed grades are available by special order.
12
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
AC ELECTRICAL CHARACTERISTICS -- ASYNCHRONOUS TIMING
(Commercial: VCC = 2.5V 5%, TA = 0C to +70C;Industrial: VCC = 2.5V 5%, TA = -40C to +85C)
Commercial IDT72T3645L4-4 IDT72T3655L4-4 IDT72T3665L4-4 IDT72T3675L4-4 IDT72T3685L4-4 IDT72T3695L4-4 IDT72T36105L4-4 IDT72T36115L4-4 IDT72T36125L4-4 Symbol fA tAA tCYC tCYH tCYL tRPE tFFA tEFA tPAFA tPAEA tOLZ tOE tOHZ tHF Parameter Cycle Frequency (Asynchronous) Data Access Time Cycle Time Cycle HIGH Time Cycle LOW Time Read Pulse after EF HIGH Clock to Asynchronous FF Clock to Asynchronous EF Clock to Asynchronous Programmable Almost-Full Flag Clock to Asynchronous Programmable Almost-Empty Flag Output Enable to Output in Low Z(1) Output Enable to Output Valid Output Enable to Output in High Z(1) Clock to HF Min. -- 0.6 10 4.5 4.5 8 -- -- -- -- 0 -- -- -- Max. 100 8 -- -- -- -- 8 8 8 8 -- 3.4 3.4 8 Com'l & Ind'l IDT72T3645L5 IDT72T3655L5 IDT72T3665L5 IDT72T3675L5 IDT72T3685L5 IDT72T3695L5 IDT72T36105L5 IDT72T36115L5 IDT72T36125L5 Min. -- 0.6 12 5 5 10 -- -- -- -- 0 -- -- -- Max. 83 10 -- -- -- -- 10 10 10 10 -- 3.6 3.6 10 Commercial IDT72T3645L6-7 IDT72T3645L10 IDT72T3655L6-7 IDT72T3655L10 IDT72T3665L6-7 IDT72T3665L10 IDT72T3675L6-7 IDT72T3675L10 IDT72T3685L6-7 IDT72T3685L10 IDT72T3695L6-7 IDT72T3695L10 IDT72T36105L6-7 IDT72T36105L10 IDT72T36115L6-7 IDT72T36115L10 IDT72T36125L6-7 IDT72T36125L10 Min. -- 0.6 15 7 7 12 -- -- -- -- 0 -- -- -- Max. 66 12 -- -- -- -- 12 12 12 12 -- 3.8 3.8 12 Min. -- 0.6 20 8 8 14 -- -- -- -- 0 -- -- -- Max. 50 14 -- -- -- -- 14 14 14 14 -- 4.5 4.5 14 Unit MHz ns ns ns ns ns ns ns ns ns ns ns ns ns
NOTES: 1. Values guaranteed by design, not currently tested. 2. Industrial temperature range product for the 5ns speed grade is available as a standard device. All other speed grades are available by special order.
13
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
HSTL 1.5V AC TEST CONDITIONS
Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels 0.25 to 1.25V 0.4ns 0.75 VDDQ/2
AC TEST LOADS
VDDQ/2 50 I/O Z0 = 50
5907 drw04
NOTE: 1. VDDQ = 1.5V.
Figure 2a. AC Test Load
EXTENDED HSTL 1.8V AC TEST CONDITIONS
tCD (Typical, ns)
Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels 0.4 to 1.4V 0.4ns 0.9 VDDQ/2
6 5 4 3 2 1
NOTE: 1. VDDQ = 1.8V.
20 30 50
80 100 Capacitance (pF)
200
5907 drw04a
Figure 2b. Lumped Capacitive Load, Typical Derating
2.5V LVTTL 2.5V AC TEST CONDITIONS
Input Pulse Levels Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels GND to 2.5V 1ns VCC/2 VDDQ/2
NOTE: 1. For LVTTL VCC = VDDQ.
14
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
OUTPUT ENABLE & DISABLE TIMING
Output Enable OE VIL Output Disable VIH
tOE & tOLZ Output VCC Normally 2 LOW
tOHZ VCC 2 VOL
100mV 100mV
Output Normally VCC 2 HIGH
NOTES: 1. REN is HIGH. 2. RCS is LOW.
100mV 100mV
VOH VCC 2
5907 drw04b
READ CHIP SELECT ENABLE & DISABLE TIMING
RCS tENS RCLK tRCSLZ Output VCC Normally 2 LOW tRCSHZ VCC 2 VOL tENH VIH VIL
100mV 100mV
Output Normally VCC 2 HIGH
100mV 100mV
VOH VCC 2
5907 drw04c
NOTES: 1. REN is HIGH. 2. OE is LOW.
15
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
FUNCTIONAL DESCRIPTION
TIMING MODES: IDT STANDARD vs FIRST WORD FALL THROUGH (FWFT) MODE The IDT72T3645/55/65/75/85/95/105/115/125 support two different timing modes of operation: IDT Standard mode or First Word Fall Through (FWFT) mode. The selection of which mode will operate is determined during Master Reset, by the state of the FWFT/SI input. If, at the time of Master Reset, FWFT/SI is LOW, then IDT Standard mode will be selected. This mode uses the Empty Flag (EF) to indicate whether or not there are any words present in the FIFO. It also uses the Full Flag function (FF) to indicate whether or not the FIFO has any free space for writing. In IDT Standard mode, every word read from the FIFO, including the first, must be requested using the Read Enable (REN) and RCLK. If, at the time of Master Reset, FWFT/SI is HIGH, then FWFT mode will be selected. This mode uses Output Ready (OR) to indicate whether or not there is valid data at the data outputs (Qn). It also uses Input Ready (IR) to indicate whether or not the FIFO has any free space for writing. In the FWFT mode, the first word written to an empty FIFO goes directly to Qn after three RCLK rising edges, REN = LOW is not necessary. Subsequent words must be accessed using the Read Enable (REN) and RCLK. Various signals, both input and output signals operate differently depending on which timing mode is in effect. IDT STANDARD MODE In this mode, the status flags, FF, PAF, HF, PAE, and EF operate in the manner outlined in Table 3. To write data into to the FIFO, Write Enable (WEN) must be LOW. Data presented to the DATA IN lines will be clocked into the FIFO on subsequent transitions of the Write Clock (WCLK). After the first write is performed, the Empty Flag (EF) will go HIGH. Subsequent writes will continue to fill up the FIFO. The Programmable Almost-Empty flag (PAE) will go HIGH after n + 1 words have been loaded into the FIFO, where n is the empty offset value. The default setting for these values are stated in the footnote of Table 2. This parameter is also user programmable. See section on Programmable Flag Offset Loading. If one continued to write data into the FIFO, and we assumed no read operations were taking place, the Half-Full flag (HF) would toggle to LOW once the 513rd word for IDT72T3645, 1,025th word for IDT72T3655, 2,049th word for IDT72T3665, 4,097th word for IDT72T3675, 8,193th word for the IDT72T3685, 16,385th word for the IDT72T3695, 32,769th word for the IDT72T36105, 65,537th word for the IDT72T36115 and 131,073rd word for the IDT72T36125, respectively was written into the FIFO. Continuing to write data into the FIFO will cause the Programmable Almost-Full flag (PAF) to go LOW. Again, if no reads are performed, the PAF will go LOW after (1,024-m) writes for the IDT72T3645, (2,048-m) writes for the IDT72T3655, (4,096-m) writes for the IDT72T3665, (8,192-m) writes for the IDT72T3675, (16,384-m) writes for the IDT72T3685, (32,768-m) writes for the IDT72T3695, (65,536-m) writes for the IDT72T36105, (131,072-m) writes for the IDT72T36115 and (262,144-m) writes for the IDT72T36125. The offset "m" is the full offset value. The default setting for these values are stated in the footnote of Table 2. This parameter is also user programmable. See section on Programmable Flag Offset Loading. When the FIFO is full, the Full Flag (FF) will go LOW, inhibiting further write operations. If no reads are performed after a reset, FF will go LOW after D writes to the FIFO. D = 1,024 writes for the IDT72T3645, 2,048 writes for the IDT72T3655, 4,096 writes for the IDT72T3665, 8,192 writes for the IDT72T3675, 16,384 writes for the IDT72T3685, 32,768 writes for the IDT72T3695, 65,536 writes for the IDT72T36105, 131,072 writes for the IDT72T36115 and 262,144
writes for the IDT72T36125, respectively. If the FIFO is full, the first read operation will cause FF to go HIGH. Subsequent read operations will cause PAF and HF to go HIGH at the conditions described in Table 3. If further read operations occur, without write operations, PAE will go LOW when there are n words in the FIFO, where n is the empty offset value. Continuing read operations will cause the FIFO to become empty. When the last word has been read from the FIFO, the EF will go LOW inhibiting further read operations. REN is ignored when the FIFO is empty. When configured in IDT Standard mode, the EF and FF outputs are double register-buffered outputs. Relevant timing diagrams for IDT Standard mode can be found in Figure 11, 12, 13 and 18. FIRST WORD FALL THROUGH MODE (FWFT) In this mode, the status flags, IR, PAF, HF, PAE, and OR operate in the manner outlined in Table 4. To write data into to the FIFO, WEN must be LOW. Data presented to the DATA IN lines will be clocked into the FIFO on subsequent transitions of WCLK. After the first write is performed, the Output Ready (OR) flag will go LOW. Subsequent writes will continue to fill up the FIFO. PAE will go HIGH after n + 2 words have been loaded into the FIFO, where n is the empty offset value. The default setting for these values are stated in the footnote of Table 2. This parameter is also user programmable. See section on Programmable Flag Offset Loading. If one continued to write data into the FIFO, and we assumed no read operations were taking place, the HF would toggle to LOW once the 514th word for the IDT72T3645, 1,026th word for the IDT72T3655, 2,050th word for the IDT72T3665, 4,098th word for the IDT72T3675, 8,194th word for the IDT72T3685, 16,386th word for the IDT72T3695, 32,770th word for the IDT72T36105, 65,538th word for the IDT72T36115 and 131,074th word for the IDT72T36125, respectively was written into the FIFO. Continuing to write data into the FIFO will cause the PAF to go LOW. Again, if no reads are performed, the PAF will goLOW after (1,025-m) writes for the IDT72T3645, (2,049-m) writes for the IDT72T3655, (4,097-m) writes for the IDT72T3665 and (8,193-m) writes for the IDT72T3675, (16,385-m) writes for the IDT72T3685, (32,769-m) writes for the IDT72T3695, (65,537-m) writes for the IDT72T36105, (131,073-m) writes for the IDT72T36115 and (262,145-m) writes for the IDT72T36125, where m is the full offset value. The default setting for these values are stated in the footnote of Table 2. When the FIFO is full, the Input Ready (IR) flag will go HIGH, inhibiting further write operations. If no reads are performed after a reset, IR will go HIGH after D writes to the FIFO. D = 1,025 writes for the IDT72T3645, 2,049 writes for the IDT72T3655, 4,097 writes for the IDT72T3665 and 8,193 writes for the IDT72T3675,16,385 writes for the IDT72T3685, 32,769 writes for the IDT72T3695, 65,537 writes for the IDT72T36105, 131,073 writes for the IDT72T36115 and 262,145 writes for the IDT72T36125, respectively. Note that the additional word in FWFT mode is due to the capacity of the memory plus output register. If the FIFO is full, the first read operation will cause the IR flag to go LOW. Subsequent read operations will cause the PAF and HF to go HIGH at the conditions described in Table 4. If further read operations occur, without write operations, the PAE will go LOW when there are n + 1 words in the FIFO, where n is the empty offset value. Continuing read operations will cause the FIFO to become empty. When the last word has been read from the FIFO, OR will go HIGH inhibiting further read operations. REN is ignored when the FIFO is empty. When configured in FWFT mode, the OR flag output is triple registerbuffered, and the IR flag output is double register-buffered. Relevant timing diagrams for FWFT mode can be found in Figure 14, 15, 16 and 19.
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
TABLE 2 -- DEFAULT PROGRAMMABLE FLAG OFFSETS
IDT72T3645, 72T3655
*LD L L L L H H H H *LD H L FSEL1 H L L H L H L H FSEL1 X X FSEL0 L H L H L L H H FSEL0 X X Offsets n,m 511 255 127 63 31 15 7 3 Program Mode Serial(3) Parallel(4)
IDT72T3665,72T3675,72T3685,72T3695, 72T36105, 72T36115, 72T36125
*LD H L L L L H H H FSEL1 L H L L H H L H FSEL0 L L H L H L H H Offsets n,m 1,023 511 255 127 63 31 15 7
PROGRAMMING FLAG OFFSETS Full and Empty Flag offset values are user programmable. The IDT72T3645/ 72T3655/72T3665/72T3675/72T3685/72T3695/72T36105/72T36115/ 72T36125 have internal registers for these offsets. There are eight default offset values selectable during Master Reset. These offset values are shown in Table 2. Offset values can also be programmed into the FIFO in one of two ways; serial or parallel loading method. The selection of the loading method is done using the LD (Load) pin. During Master Reset, the state of the LD input determines whether serial or parallel flag offset programming is enabled. A HIGH on LD during Master Reset selects serial loading of offset values. A LOW on LD during Master Reset selects parallel loading of offset values. In addition to loading offset values into the FIFO, it is also possible to read the current offset values. Offset values can be read via the parallel output port Q0-Qn, regardless of the programming mode selected (serial or parallel). It is not possible to read the offset values in serial fashion. Figure 3, Programmable Flag Offset Programming Sequence, summaries the control pins and sequence for both serial and parallel programming modes. For a more detailed description, see discussion that follows. The offset registers may be programmed (and reprogrammed) any time after Master Reset, regardless of whether serial or parallel programming has been selected. Valid programming ranges are from 0 to D-1. SYNCHRONOUS vs ASYNCHRONOUS PROGRAMMABLE FLAG TIMING SELECTION The IDT72T3645/72T3655/72T3665/72T3675/72T3685/72T3695/ 72T36105/72T36115/72T36125 can be configured during the Master Reset cycle with either synchronous or asynchronous timing for PAF and PAE flags by use of the PFM pin. If synchronous PAF/PAE configuration is selected (PFM, HIGH during MRS), the PAF is asserted and updated on the rising edge of WCLK only and not RCLK. Similarly, PAE is asserted and updated on the rising edge of RCLK only and not WCLK. For detail timing diagrams, see Figure 23 for synchronous PAF timing and Figure 24 for synchronous PAE timing. If asynchronous PAF/PAE configuration is selected (PFM, LOW during MRS), the PAF is asserted LOW on the LOW-to-HIGH transition of WCLK and PAF is reset to HIGH on the LOW-to-HIGH transition of RCLK. Similarly, PAE is asserted LOW on the LOW-to-HIGH transition of RCLK. PAE is reset to HIGH on the LOW-to-HIGH transition of WCLK. For detail timing diagrams, see Figure 25 for asynchronous PAF timing and Figure 26 for asynchronous PAE timing.
*LD FSEL1 FSEL0 Program Mode H X X Serial(3) L X X Parallel(4) *THIS PIN MUST BE HIGH AFTER MASTER RESET TO WRITE OR READ DATA TO/FROM THE FIFO MEMORY.
NOTES: 1. n = empty offset for PAE. 2. m = full offset for PAF. 3. As well as selecting serial programming mode, one of the default values will also be loaded depending on the state of FSEL0 & FSEL1. 4. As well as selecting parallel programming mode, one of the default values will also be loaded depending on the state of FSEL0 & FSEL1.
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
TABLE 3 STATUS FLAGS FOR IDT STANDARD MODE
IDT72T3645
0
IDT72T3655
0
(1)
IDT72T3665
0 1 to n
(1)
IDT72T3675
0 1 to n
(1)
IDT72T3685
0 1 to n
(1)
FF
H H H H H L
PAF HF PAE EF
H H H H L L H H H L L L L L H H H H L H H H H H
Number of Words in FIFO
1 to n
(1)
1 to n
(n+1) to 512 513 to (1,024-(m+1)) (1024-m) to 1,023 1,024
(n+1) to 1,024 1,025 to (2048-(m+1)) (2048-m) to 2,047
(n+1) to 2,048 2,049 to (4,096-(m+1)) (4,096-m) to 4,095 4,096
(n+1) to 4,096 4,097 to (8,192-(m+1)) (8,192-m) to 8,191 8,192
(n+1) to 8,192 8,193 to (16,384-(m+1)) (16,384-m) to 16,383 16,384
2,048
IDT72T3695
0
IDT72T36105
0
(1)
IDT72T36115
0 1 to n
(1)
IDT72T36125
0 1 to n (1) (n+1) to 131,072
FF PAF HF PAE EF
H H H H H L H H H H L L H H H L L L L L H H H H L H H H H H
Number of Words in FIFO
1 to n
(1)
(n+1) to 16,384
1 to n (n+1) to 32,768
(n+1) to 65,536
16,385 to (32,768-(m+1)) 32,769 to (65,536-(m+1)) 65,537 to (131,072-(m+1)) 131,073 to (262,144-(m+1)) (32,768-m) to 32,767 32,768 (65,536-m) to 65,535 65,536 (131,072-m) to 131,071 131,072 (262,144-m) to 262,143 262,144
NOTE: 1. See table 2 for values for n, m.
TABLE 4 STATUS FLAGS FOR FWFT MODE
IDT72T3645
0
IDT72T3655
0 1 to n+1 (n+2) to 1,025 1,026 to (2,049-(m+1)) (2,049-m) to 2,048 2,049
IDT72T3665
0 1 to n+1 (n+2) to 2,049 2,050 to (4,097-(m+1)) (4,097-m) to 4,096
IDT72T3675
0 1 to n+1 (n+2) to 4,097 4,098 to (8,193-(m+1)) (8,193-m) to 8,192
IDT72T3685
0 1 to n+1 (n+2) to 8,193 8,194 to (16,385-(m+1)) (16,385-m) to 16,384 16,385
IR
L L L L L H
PAF HF PAE OR
H H H H L L H H H L L L L L H H H H H L L L L L
Number of Words in FIFO
1 to n+1 (n+2) to 513 514 to (1,025-(m+1)) (1,025-m) to 1,024 1,025
4,097
8,193
IDT72T3695
0
IDT72T36105
0 1 to n+1
IDT72T36115
0 1 to n+1
IDT72T36125
0 1 to n+1
IR
L L L L L H
PAF HF PAE OR
H H H H L L H H H L L L L L H H H H H L L L L L
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Number of Words in FIFO
1 to n+1 (n+2) to 16,385 16,386 to (32,769-(m+1)) (32,769-m) to 32,768 32,769
(n+2) to 32,769 (n+2) to 65,537 (n+2) to 131,073 32,770 to (65,537-(m+1)) 65,538 to (131,073-(m+1)) 131,074 to (262,145-(m+1)) (65,537-m) to 65,536 65,537 (131,073-m) to 131,072 131,073 (262,145-m) to 262,144 262,145
NOTE: 1. See table 2 for values for n, m.
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
LD 0
WEN 0
REN 1
SEN 1
WCLK
RCLK X
SCLK X
IDT72T3645, IDT72T3655 IDT72T3665, IDT72T3675 IDT72T3685, IDT72T3695 IDT72T36105, IDT72T36115 IDT72T36125 Parallel write to registers: Empty Offset (LSB) Empty Offset (MSB) Full Offset (LSB) Full Offset (MSB) Parallel read from registers: Empty Offset (LSB) Empty Offset (MSB) Full Offset (LSB) Full Offset (MSB) Serial shift into registers: 20 bits for the IDT72T3645 22 bits for the IDT72T3655 24 bits for the IDT72T3665 26 bits for the IDT72T3675 28 bits for the IDT72T3685 30 bits for the IDT72T3695 32 bits for the IDT72T36105 34 bits for the IDT72T36115 36 bits for the IDT72T36125 1 bit for each rising SCLK edge Starting with Empty Offset (LSB) Ending with Full Offset (MSB)
0
1
0
1
X
X
0
1
1
0
X
X
X 1 1 1
1 0 X 1
1 X 0 1
1 X X X
X
X X
X X X
No Operation Write Memory Read Memory No Operation
5907 drw06
X X X
X
NOTES: 1. The programming method can only be selected at Master Reset. 2. Parallel reading of the offset registers is always permitted regardless of which programming method has been selected. 3. The programming sequence applies to both IDT Standard and FWFT modes.
Figure 3. Programmable Flag Offset Programming Sequence
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
D/Q35
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1st Parallel Offset Write/Read Cycle D/Q19 D/Q17 D/Q8 EMPTY OFFSET REGISTER (PAE) 18 17 16 15 14 13 12 11 10 9 8 7 6 18 17 16 15 14 13 12 11 10 9
D/Q0
Non-Interspersed Parity Interspersed Parity
54321 87654321
# of Bits Used
D/Q35
D/Q0 FULL OFFSET REGISTER (PAF) 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 87654321 16 15 14 13 12 11 10 9 18 17
# of Bits Used
2nd Parallel Offset Write/Read Cycle D/Q19 D/Q17 D/Q8
Non-Interspersed Parity Interspersed Parity
IDT72T3645/55/65/75/85/95/105/115/125 x36 Bus Width
# of Bits Used: 10 bits for the IDT72T3645 11 bits for the IDT72T3655 12 bits for the IDT72T3665 13 bits for the IDT72T3675 14 bits for the IDT72T3685 15 bits for the IDT72T3695 16 bits for the IDT72T36105 17 bits for the IDT72T36115 18 bits for the IDT72T36125 Note: All unused bits of the LSB & MSB are don't care
1st Parallel Offset Write/Read Cycle D/Q17 Data Inputs/Outputs D/Q0 D/Q16 EMPTY OFFSET (LSB) REGISTER (PAE) 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 16 15 14 13 12 11 10 9 87654321 D/Q8
# of Bits Used
Non-Interspersed Parity Interspersed Parity
1st Parallel Offset Write/Read Cycle D/Q17 Data Inputs/Outputs D/Q16 D/Q0 EMPTY OFFSET (LSB) REGISTER (PAE) 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 87654321 16 15 14 13 12 11 10 9 D/Q8 # of Bits Used 2nd Parallel Offset Write/Read Cycle D/Q17 D/Q16 Data Inputs/Outputs EMPTY OFFSET (MSB) REGISTER (PAE) 18 17 18 17
Non-Interspersed Parity Interspersed Parity
D/Q0
2nd Parallel Offset Write/Read Cycle D/Q17 Data Inputs/Outputs D/Q16
D/Q0
FULL OFFSET (LSB) REGISTER (PAF) 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 16 15 14 13 12 11 10 9 87654321 D/Q8
3rd Parallel Offset Write/Read Cycle D/Q17 Data Inputs/Outputs D/Q0 D/Q16 FULL OFFSET (LSB) REGISTER (PAF) 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 16 15 14 13 12 11 10 9 87654321 D/Q8 4th Parallel Offset Write/Read Cycle D/Q17 D/Q16 Data Inputs/Outputs FULL OFFSET (MSB) REGISTER (PAF) 18 17 18 17
D/Q0
IDT72T3645/55/65/75/85/95/105 x18 Bus Width
1st Parallel Offset Write/Read Cycle D/Q8 EMPTY OFFSET REGISTER (PAE) 8 7 6 5 4 3 2
IDT72T36115/72T36125 x18 Bus Width
1st Parallel Offset Write/Read Cycle D/Q8 EMPTY OFFSET REGISTER (PAE) 8 7 6 5 4 3 2
D/Q0
D/Q0
1
1
2nd Parallel Offset Write/Read Cycle D/Q8 EMPTY OFFSET REGISTER (PAE) 2nd Parallel Offset Write/Read Cycle D/Q8 EMPTY OFFSET REGISTER (PAE) 16 15 14 13 12 11 10
D/Q0
D/Q0
16
15
14
13
12
11
10
9
9
3rd Parallel Offset Write/Read Cycle D/Q8 EMPTY OFFSET REGISTER (PAE) 18
D/Q0
17
3rd Parallel Offset Write/Read Cycle D/Q8 FULL OFFSET REGISTER (PAF) 8 7 6 5 4 3 2
D/Q0
4th Parallel Offset Write/Read Cycle D/Q8 FULL OFFSET REGISTER (PAF) 8 7 6 5 4 3 2
D/Q0
1
1
5th Parallel Offset Write/Read Cycle D/Q8 FULL OFFSET REGISTER (PAF) 4th Parallel Offset Write/Read Cycle D/Q8 FULL OFFSET REGISTER (PAF) 16 15 14 13 12 11 10 16
D/Q0
D/Q0
15
14
13
12
11
10
9
9
6th Parallel Offset Write/Read Cycle D/Q8 FULL OFFSET REGISTER (PAF) 18
D/Q0
17
IDT72T3645/55/65/75/85/95/105 x9 Bus Width
IDT72T36115/72T36125 x9 Bus Width
5907 drw07
NOTE: 1. Consecutive reads of the offset registers is not permitted. The read operation must be disabled for a minimum of one RCLK cycle in between offset register accesses. (Please refer to Figure 22, Parallel Read of Programmable Flag Registers (IDT Standard and FWFT Modes) for more details).
Figure 3. Programmable Flag Offset Programming Sequence (Continued)
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
SERIAL PROGRAMMING MODE If Serial Programming mode has been selected, as described above, then programming of PAE and PAF values can be achieved by using a combination of the LD, SEN, SCLK and SI input pins. Programming PAE and PAF proceeds as follows: when LD and SEN are set LOW, data on the SI input are written, one bit for each SCLK rising edge, starting with the Empty Offset LSB and ending with the Full Offset MSB. A total of 20 bits for the IDT72T3645, 22 bits for the IDT72T3655, 24 bits for the IDT72T3665, 26 bits for the IDT72T3675, 28 bits for the IDT72T3685, 30 bits for the IDT72T3695, 32 bits for the IDT72T36105, 34 bits for the IDT72T36115 and 36 bits for the IDT72T36125. See Figure 20, Serial Loading of Programmable Flag Registers, for the timing diagram for this mode. Using the serial method, individual registers cannot be programmed selectively. PAE and PAF can show a valid status only after the complete set of bits (for all offset registers) has been entered. The registers can be reprogrammed as long as the complete set of new offset bits is entered. When LD is LOW and SEN is HIGH, no serial write to the registers can occur. Write operations to the FIFO are allowed before and during the serial programming sequence. In this case, the programming of all offset bits does not have to occur at once. A select number of bits can be written to the SI input and then, by bringing LD and SEN HIGH, data can be written to FIFO memory via Dn by toggling WEN. When WEN is brought HIGH with LD and SEN restored to a LOW, the next offset bit in sequence is written to the registers via SI. If an interruption of serial programming is desired, it is sufficient either to set LD LOW and deactivate SEN or to set SEN LOW and deactivate LD. Once LD and SEN are both restored to a LOW level, serial offset programming continues. From the time serial programming has begun, neither programmable flag will be valid until the full set of bits required to fill all the offset registers has been written. Measuring from the rising SCLK edge that achieves the above criteria; PAF will be valid after three more rising WCLK edges plus tPAF, PAE will be valid after the next three rising RCLK edges plus tPAE. It is only possible to read the flag offset values via the parallel output port Qn. PARALLEL MODE If Parallel Programming mode has been selected, as described above, then programming of PAE and PAF values can be achieved by using a combination of the LD, WCLK , WEN and Dn input pins. Programming PAE and PAF proceeds as follows: LD and WEN must be set LOW. When programming the Offset Registers of the TeraSync FIFO's the number of programming cycles will be based on the bus width, the following rules apply: When a 36 bit input bus width is used: For the IDT72T3645/72T3655/72T3665/72T3675/72T3685/72T3695/ 72T36105/72T36115/72T36125, 2 enabled write cycles are required to program the offset registers, (1 per offset). Data on the inputs Dn are written into the Empty Offset Register on the first LOW-to-HIGH transition of WCLK. Upon the second LOW-to-HIGH transition of WCLK, data are written into the Full Offset Register. The third transition of WCLK writes, once again, to the Empty Offset Register. When an 18 bit input bus width is used: For the IDT72T3645/72T3655/72T3665/72T3675/72T3685/72T3695/ 72T36105, 2 enabled write cycles are required to program the offset registers, (1 per offset). Data on the inputs Dn are written into the Empty Offset Register on the first LOW-to-HIGH transition of WCLK. Upon the second LOW-to-HIGH transition of WCLK, data are written into the Full Offset Register. The third transition of WCLK writes, once again, to the Empty Offset Register. For the IDT72T36115/72T36125, 4 enabled write cycles are required to load the offset registers, (2 per offset). Data on the inputs Dn are written into the Empty Offset Register LSB on the first LOW-to-HIGH transition of WCLK. Upon
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the 2nd LOW-to-HIGH transition of WCLK data on the inputs Dn are written into the Empty Offset Register MSB. Upon the 3rd LOW-to-HIGH transition of WCLK data on the inputs Dn are written into the Full Offset Register LSB. Upon the 4th LOW-to-HIGH transition of WCLK data on the inputs Dn are written into the Full Offset Register MSB. The 5th LOW-to-HIGH transition of WCLK data on the inputs Dn are once again written into the Empty Offset Register LSB. When a 9 bit input bus width is used: For the IDT72T3645/72T3655/72T3665/72T3675/72T3685/72T3695/ 72T36105, 4 enabled write cycles are required to load the offset registers, (2 per offset). Data on the inputs Dn are written into the Empty Offset Register LSB on the first LOW-to-HIGH transition of WCLK. Upon the 2nd LOW-to-HIGH transition of WCLK data on the inputs Dn are written into the Empty Offset Register MSB. Upon the 3rd LOW-to-HIGH transition of WCLK data on the inputs Dn are written into the Full Offset Register LSB. Upon the 4th LOW-to-HIGH transition of WCLK data on the inputs Dn are written into the Full Offset Register MSB. The 5th LOW-to-HIGH transition of WCLK data on the inputs Dn are once again written into the Empty Offset Register LSB. For the IDT72T36115/72T36125, 6 enabled write cycles are required to load the offset registers, (3 per offset). Data on the inputs Dn are written into the Empty Offset Register LSB on the first LOW-to-HIGH transition of WCLK. Upon the 3rd LOW-to-HIGH transition of WCLK data on the inputs Dn are written into the Empty Offset Register MSB. Upon the 4th LOW-to-HIGH transition of WCLK data on the inputs Dn are written into the Full Offset Register LSB. Upon the 6th LOW-to-HIGH transition of WCLK data on the inputs Dn are written into the Full Offset Register MSB. The 7th LOW-to-HIGH transition of WCLK data on the inputs Dn are once again written into the Empty Offset Register LSB. See Figure 3, Programmable Flag Offset Programming Sequence. See Figure 21, Parallel Loading of Programmable Flag Registers, for the timing diagram for this mode. The act of writing offsets in parallel employs a dedicated write offset register pointer. The act of reading offsets employs a dedicated read offset register pointer. The two pointers operate independently; however, a read and a write should not be performed simultaneously to the offset registers. A Master Reset initializes both pointers to the Empty Offset (LSB) register. A Partial Reset has no effect on the position of these pointers. Write operations to the FIFO are allowed before and during the parallel programming sequence. In this case, the programming of all offset registers does not have to occur at one time. One, two or more offset registers can be written and then by bringing LD HIGH, write operations can be redirected to the FIFO memory. When LD is set LOW again, and WEN is LOW, the next offset register in sequence is written to. As an alternative to holding WEN LOW and toggling LD, parallel programming can also be interrupted by setting LD LOW and toggling WEN. Note that the status of a programmable flag (PAE or PAF) output is invalid during the programming process. From the time parallel programming has begun, a programmable flag output will not be valid until the appropriate offset word has been written to the register(s) pertaining to that flag. Measuring from the rising WCLK edge that achieves the above criteria; PAF will be valid after two more rising WCLK edges plus tPAF, PAE will be valid after the next two rising RCLK edges plus tPAE plus tSKEW2. The act of reading the offset registers employs a dedicated read offset register pointer. The contents of the offset registers can be read on the Q0-Qn pins when LD is set LOW and REN is set LOW. It is important to note that consecutive reads of the offset registers is not permitted. The read operation must be disabled for a minimum of one RCLK cycle in between offset register accesses. When reading the Offset Registers of the TeraSync FIFO's the number of reading cycles will be based on the bus width, the following rules apply:
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
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When a 36 bit output bus width is used: For the IDT72T3645/72T3655/72T3665/72T3675/72T3685/72T3695/ 72T36105/72T36115/72T36125, 2 enabled read cycles are required to read the offset registers, (1 per offset). Data on the outputs Qn are read from the Empty Offset Register on the first LOW-to-HIGH transition of RCLK. Upon the second LOW-to-HIGH transition of RCLK, data are read from the Full Offset Register. The third transition of RCLK reads, once again, from the Empty Offset Register. When an 18 bit output bus width is used: For the IDT72T3645/72T3655/72T3665/72T3675/72T3685/72T3695/ 72T36105, 2 enabled read cycles are required to read the offset registers, (1 per offset). Data on the outputs Qn are read from the Empty Offset Register on the first LOW-to-HIGH transition of RCLK. Upon the second LOW-to-HIGH transition of RCLK, data are read from the Full Offset Register. The third transition of RCLK reads, once again, from the Empty Offset Register. For the IDT72T36115/72T36125, 4 enabled read cycles are required to read the offset registers, (2 per offset). Data on the outputs Qn are read from the Empty Offset Register LSB on the first LOW-to-HIGH transition of RCLK. Upon the 2nd LOW-to-HIGH transition of RCLK data on the outputs Qn are read from the Empty Offset Register MSB. Upon the 3rd LOW-to-HIGH transition of RCLK data on the outputs Qn are read from the Full Offset Register LSB. Upon the 4th LOW-to-HIGH transition of RCLK data on the outputs Qn are read from the Full Offset Register MSB. The 5th LOW-to-HIGH transition of RCLK data on the outputs Qn are once again read from the Empty Offset Register LSB. When a 9 bit output bus width is used: For the IDT72T36115/72T36125, 4 enabled read cycles are required to read the offset registers, (2 per offset). Data on the outputs Qn are read from the Empty Offset Register LSB on the first LOW-to-HIGH transition of RCLK. Upon the 2nd LOW-to-HIGH transition of RCLK data on the outputs Qn are read from the Empty Offset Register MSB. Upon the 3rd LOW-to-HIGH transition of RCLK data on the outputs Qn are read from the Full Offset Register LSB. Upon the 4th LOW-to-HIGH transition of RCLK data on the outputs Qn are read from the Full Offset Register MSB. The 5th LOW-to-HIGH transition of RCLK data on the outputs Qn are once again read from the Empty Offset Register LSB. For the IDT72T36115/72T36125, 6 enabled read cycles are required to read the offset registers, (3 per offset). Data on the outputs Qn are read from the Empty Offset Register LSB on the first LOW-to-HIGH transition of RCLK. Upon the 3rd LOW-to-HIGH transition of RCLK data on the outputs Qn are read from the Empty Offset Register MSB. Upon the 4th LOW-to-HIGH transition of RCLK data on the outputs Qn are read from the Full Offset Register LSB. Upon the 6th LOW-to-HIGH transition of RCLK data on the outputs Qn are read from the Full Offset Register MSB. The 7th LOW-to-HIGH transition of RCLK data on the outputs Qn are once again read from the Empty Offset Register LSB. See Figure 3, Programmable Flag Offset Programming Sequence. See Figure 22, Parallel Read of Programmable Flag Registers, for the timing diagram for this mode. It is permissible to interrupt the offset register read sequence with reads or writes to the FIFO. The interruption is accomplished by deasserting REN, LD, or both together. When REN and LD are restored to a LOW level, reading of the offset registers continues where it left off. It should be noted, and care should be taken from the fact that when a parallel read of the flag offsets is performed, the data word that was present on the output lines Qn will be overwritten. Parallel reading of the offset registers is always permitted regardless of which timing mode (IDT Standard or FWFT modes) has been selected. RETRANSMIT FROM MARK OPERATION The Retransmit from Mark feature allows FIFO data to be read repeatedly starting at a user-selected position. The FIFO is first put into retransmit mode that
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will `mark' a beginning word and also set a pointer that will prevent ongoing FIFO write operations from over-writing retransmit data. The retransmit data can be read repeatedly any number of times from the `marked' position. The FIFO can be taken out of retransmit mode at any time to allow normal device operation. The `mark' position can be selected any number of times, each selection overwriting the previous mark location. Retransmit operation is available in both IDT standard and FWFT modes. During IDT standard mode the FIFO is put into retransmit mode by a Lowto-High transition on RCLK when the `MARK' input is HIGH and EF is HIGH. The rising RCLK edge `marks' the data present in the FIFO output register as the first retransmit data. The FIFO remains in retransmit mode until a rising edge on RCLK occurs while MARK is LOW. Once a `marked' location has been set (and the device is still in retransmit mode, MARK is HIGH), a retransmit can be initiated by a rising edge on RCLK while the retransmit input (RT) is LOW. REN must be HIGH (reads disabled) before bringing RT LOW. The device indicates the start of retransmit setup by setting EF LOW, also preventing reads. When EF goes HIGH, retransmit setup is complete and read operations may begin starting with the first data at the MARK location. Since IDT standard mode is selected, every word read including the first `marked' word following a retransmit setup requires a LOW on REN (read enabled). Note, write operations may continue as normal during all retransmit functions, however write operations to the `marked' location will be prevented. See Figure 18, Retransmit from Mark (IDT standard mode), for the relevant timing diagram. During FWFT mode the FIFO is put into retransmit mode by a rising RCLK edge when the `MARK' input is HIGH and OR is LOW. The rising RCLK edge `marks' the data present in the FIFO output register as the first retransmit data. The FIFO remains in retransmit mode until a rising RCLK edge occurs while MARK is LOW. Once a marked location has been set (and the device is still in retransmit mode, MARK is HIGH), a retransmit can be initiated by a rising RCLK edge while the retransmit input (RT) is LOW. REN must be HIGH (reads disabled) before bringing RT LOW. The device indicates the start of retransmit setup by setting OR HIGH. When OR goes LOW, retransmit setup is complete and on the next rising RCLK edge after retransmit setup is complete, (RT goes HIGH), the contents of the first retransmit location are loaded onto the output register. Since FWFT mode is selected, the first word appears on the outputs regardless of REN, a LOW on REN is not required for the first word. Reading all subsequent words requires a LOW on REN to enable the rising RCLK edge. See Figure 19, Retransmit from Mark timing (FWFT mode), for the relevant timing diagram. Note, there must be a minimum of 32 bytes of data between the write pointer and read pointer when the MARK is asserted. (32 bytes = 16 word = 8 long words). Also, once the MARK is set, the write pointer will not increment past the "marked" location until the MARK is deasserted. This prevents "overwriting" of retransmit data. HSTL/LVTTL I/O Both the write port and read port are user selectable between HSTL or LVTTL I/O, via two select pins, WHSTL and RHSTL respectively. All other control pins are selectable via SHSTL, see Table 5 for details of groupings. Note, that when the write port is selected for HSTL mode, the user can reduce the power consumption (in stand-by mode by utilizing the WCS input). All "Static Pins" must be tied to VCC or GND. These pins are LVTTL only, and are purely device configuration pins.
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
TABLE 5 -- I/O CONFIGURATION
WHSTL SELECT WHSTL: HIGH = HSTL LOW = LVTTL Dn (I/P) WCLK/WR (I/P) WEN (I/P) WCS (I/P) RHSTL SELECT RHSTL: HIGH = HSTL LOW = LVTTL RCLK/RD (I/P) RCS (I/P) MARK (I/P) REN (I/P) OE (I/P) RT (I/P) Qn (O/P) EF/OR (O/P) PAF (O/P) EREN (O/P) PAE (O/P) FF/IR (O/P) HF (O/P) ERCLK (O/P) TDO (O/P) SHSTL SELECT SHSTL: HIGH = HSTL LOW = LVTTL SCLK (I/P) LD (I/P) MRS (I/P) TCK (I/P) TMS (I/P) SEN (I/P) FWFT/SI (I/P) PRS (I/P) TRST (I/P) TDI (I/P) STATIC PINS LVTTL ONLY IW (I/P) BM (I/P) ASYR (I/P) IP (I/P) FSEL1 (I/P) SHSTL (I/P) RHSTL (I/P) OW (I/P) ASYW (I/P) BE (I/P) FSEL0 (I/P) PFM (I/P) WHSTL (I/P)
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
SIGNAL DESCRIPTION INPUTS:
DATA IN (D0 - Dn) Data inputs for 36-bit wide data (D0 - D35), data inputs for 18-bit wide data (D0 - D17) or data inputs for 9-bit wide data (D0 - D8).
CONTROLS:
MASTER RESET ( MRS ) A Master Reset is accomplished whenever the MRS input is taken to a LOW state. This operation sets the internal read and write pointers to the first location of the RAM array. PAE will go LOW, PAF will go HIGH, and HF will go HIGH. If FWFT/SI is LOW during Master Reset then the IDT Standard mode, along with EF and FF are selected. EF will go LOW and FF will go HIGH. If FWFT/SI is HIGH, then the First Word Fall Through mode (FWFT), along with IR and OR, are selected. OR will go HIGH and IR will go LOW. All control settings such as OW, IW, BM, BE, RM, PFM and IP are defined during the Master Reset cycle. During a Master Reset, the output register is initialized to all zeroes. A Master Reset is required after power up, before a write operation can take place. MRS is asynchronous. See Figure 9, Master Reset Timing, for the relevant timing diagram. PARTIAL RESET (PRS) A Partial Reset is accomplished whenever the PRS input is taken to a LOW state. As in the case of the Master Reset, the internal read and write pointers are set to the first location of the RAM array, PAE goes LOW, PAF goes HIGH, and HF goes HIGH. Whichever mode is active at the time of Partial Reset, IDT Standard mode or First Word Fall Through, that mode will remain selected. If the IDT Standard mode is active, then FF will go HIGH and EF will go LOW. If the First Word Fall Through mode is active, then OR will go HIGH, and IR will go LOW. Following Partial Reset, all values held in the offset registers remain unchanged. The programming method (parallel or serial) currently active at the time of Partial Reset is also retained. The output register is initialized to all zeroes. PRS is asynchronous. A Partial Reset is useful for resetting the device during the course of operation, when reprogramming programmable flag offset settings may not be convenient. See Figure 10, Partial Reset Timing, for the relevant timing diagram. ASYNCHRONOUS WRITE (ASYW) The write port can be configured for either Synchronous or Asynchronous mode of operation. If during Master Reset the ASYW input is LOW, then Asynchronous operation of the write port will be selected. During Asynchronous operation of the write port the WCLK input becomes WR input, this is the Asynchronous write strobe input. A rising edge on WR will write data present on the Dn inputs into the FIFO. (WEN must be tied LOW when using the write port in Asynchronous mode). When the write port is configured for Asynchronous operation the full flag (FF) operates in an asynchronous manner, that is, the full flag will be updated based in both a write operation and read operation. Note, if Asynchronous mode is selected, FWFT is not permissable. Refer to Figures 30, 31, 34 and 35 for relevant timing and operational waveforms. ASYNCHRONOUS READ (ASYR) The read port can be configured for either Synchronous or Asynchronous mode of operation. If during a Master Reset the ASYR input is LOW, then
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Asynchronous operation of the read port will be selected. During Asynchronous operation of the read port the RCLK input becomes RD input, this is the Asynchronous read strobe input. A rising edge on RD will read data from the FIFO via the output register and Qn port. (REN must be tied LOW during Asynchronous operation of the read port). The OE input provides three-state control of the Qn output bus, in an asynchronous manner. (RCS, provides three-state control of the read port in Synchronous mode). When the read port is configured for Asynchronous operation the device must be operating on IDT standard mode, FWFT mode is not permissible if the read port is Asynchronous. The Empty Flag (EF) operates in an Asynchronous manner, that is, the empty flag will be updated based on both a read operation and a write operation. Refer to figures 32, 33, 34 and 35 for relevant timing and operational waveforms. RETRANSMIT (RT) The Retransmit (RT) input is used in conjunction with the MARK input, together they provide a means by which data previously read out of the FIFO can be reread any number of times. If retransmit operation has been selected (i.e. the MARK input is HIGH), a rising edge on RCLK while RT is LOW will reset the read pointer back to the memory location set by the user via the MARK input. If IDT standard mode has been selected the EF flag will go LOW and remain LOW for the time that RT is held LOW. RT can be held LOW for any number of RCLK cycles, the read pointer being reset to the marked location. The next rising edge of RCLK after RT has returned HIGH, will cause EF to go HIGH, allowing read operations to be performed on the FIFO. The next read operation will access data from the `marked' memory location. Subsequent retransmit operations may be performed, each time the read pointer returning to the `marked' location. See Figure 18, Retransmit from Mark (IDT Standard mode) for the relevant timing diagram. If FWFT mode has been selected the OR flag will go HIGH and remain HIGH for the time that RT is held LOW. RT can be held LOW for any number of RCLK cycles, the read pointer being reset to the `marked' location. The next RCLK rising edge after RT has returned HIGH, will cause OR to go LOW and due to FWFT operation, the contents of the marked memory location will be loaded onto the output register, a read operation being required for all subsequent data reads. Subsequent retransmit operations may be performed each time the read pointer returning to the `marked' location. See Figure 19, Retransmit from Mark (FWFT mode) for the relevant timing diagram. MARK The MARK input is used to select Retransmit mode of operation. An RCLK rising edge while MARK is HIGH will mark the memory location of the data currently present on the output register, the device will also be placed into retransmit mode. Note, for the IDT72T3645/72T3655/72T3665/72T3675/ 72T3685/72T3695 there must be a minimum of 32 bytes of data between the write pointer and read pointer when the MARK is asserted. For the IDT72T36105/ 72T36115 there must be a minimum of 128 bytes, for the IDT72T36125 a minimum of 256 bytes. Remember, 4 (x9) bytes = 2 (x18) words = 1 (x36) word. Also, once the MARK is set, the write pointer will not increment past the "marked" location until the MARK is deasserted. This prevents "overwriting" of retransmit data. The MARK input must remain HIGH during the whole period of retransmit mode, a falling edge of RCLK while MARK is LOW will take the device out of retransmit mode and into normal mode. Any number of MARK locations can be set during FIFO operation, only the last marked location taking effect. Once a mark location has been set the write pointer cannot be incremented past this
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
marked location. During retransmit mode write operations to the device may continue without hindrance. FIRST WORD FALL THROUGH/SERIAL IN (FWFT/SI) This is a dual purpose pin. During Master Reset, the state of the FWFT/ SI input determines whether the device will operate in IDT Standard mode or First Word Fall Through (FWFT) mode. If, at the time of Master Reset, FWFT/SI is LOW, then IDT Standard mode will be selected. This mode uses the Empty Flag (EF) to indicate whether or not there are any words present in the FIFO memory. It also uses the Full Flag function (FF) to indicate whether or not the FIFO memory has any free space for writing. In IDT Standard mode, every word read from the FIFO, including the first, must be requested using the Read Enable (REN) and RCLK. If, at the time of Master Reset, FWFT/SI is HIGH, then FWFT mode will be selected. This mode uses Output Ready (OR) to indicate whether or not there is valid data at the data outputs (Qn). It also uses Input Ready (IR) to indicate whether or not the FIFO memory has any free space for writing. In the FWFT mode, the first word written to an empty FIFO goes directly to Qn after three RCLK rising edges, REN = LOW is not necessary. Subsequent words must be accessed using the Read Enable (REN) and RCLK. After Master Reset, FWFT/SI acts as a serial input for loading PAE and PAF offsets into the programmable registers. The serial input function can only be used when the serial loading method has been selected during Master Reset. Serial programming using the FWFT/SI pin functions the same way in both IDT Standard and FWFT modes. WRITE STROBE & WRITE CLOCK (WR/WCLK) If Synchronous operation of the write port has been selected via ASYW, this input behaves as WCLK. A write cycle is initiated on the rising edge of the WCLK input. Data setup and hold times must be met with respect to the LOW-to-HIGH transition of the WCLK. It is permissible to stop the WCLK. Note that while WCLK is idle, the FF/ IR, PAF and HF flags will not be updated. (Note that WCLK is only capable of updating HF flag to LOW). The Write and Read Clocks can either be independent or coincident. If Asynchronous operation has been selected this input is WR (write strobe). Data is Asynchronously written into the FIFO via the Dn inputs whenever there is a rising edge on WR. In this mode the WEN input must be tied LOW. WRITE ENABLE (WEN) When the WEN input is LOW, data may be loaded into the FIFO RAM array on the rising edge of every WCLK cycle if the device is not full. Data is stored in the RAM array sequentially and independently of any ongoing read operation. When WEN is HIGH, no new data is written in the RAM array on each WCLK cycle. To prevent data overflow in the IDT Standard mode, FF will go LOW, inhibiting further write operations. Upon the completion of a valid read cycle, FF will go HIGH allowing a write to occur. The FF is updated by two WCLK cycles + tSKEW after the RCLK cycle. To prevent data overflow in the FWFT mode, IR will go HIGH, inhibiting further write operations. Upon the completion of a valid read cycle, IR will go LOW allowing a write to occur. The IR flag is updated by two WCLK cycles + tSKEW after the valid RCLK cycle. WEN is ignored when the FIFO is full in either FWFT or IDT Standard mode. If Asynchronous operation of the write port has been selected, then WEN must be held active, (tied LOW).
READ STROBE & READ CLOCK (RD/RCLK) If Synchronous operation of the read port has been selected via ASYR, this input behaves as RCLK. A read cycle is initiated on the rising edge of the RCLK input. Data can be read on the outputs, on the rising edge of the RCLK input. It is permissible to stop the RCLK. Note that while RCLK is idle, the EF/OR, PAE and HF flags will not be updated. (Note that RCLK is only capable of updating the HF flag to HIGH). The Write and Read Clocks can be independent or coincident. If Asynchronous operation has been selected this input is RD (Read Strobe) . Data is Asynchronously read from the FIFO via the output register whenever there is a rising edge on RD. In this mode the REN and RCS inputs must be tied LOW. The OE input is used to provide Asynchronous control of the three-state Qn outputs. WRITE CHIP SELECT (WCS) The WCS disables all Write Port inputs (data only) if it is held HIGH. To perform normal operations on the write port, the WCS must be enabled, held LOW. READ ENABLE (REN) When Read Enable is LOW, data is loaded from the RAM array into the output register on the rising edge of every RCLK cycle if the device is not empty. When the REN input is HIGH, the output register holds the previous data and no new data is loaded into the output register. The data outputs Q0-Qn maintain the previous data value. In the IDT Standard mode, every word accessed at Qn, including the first word written to an empty FIFO, must be requested using REN provided that RCS is LOW. When the last word has been read from the FIFO, the Empty Flag (EF) will go LOW, inhibiting further read operations. REN is ignored when the FIFO is empty. Once a write is performed, EF will go HIGH allowing a read to occur. The EF flag is updated by two RCLK cycles + tSKEW after the valid WCLK cycle. Both RCS and REN must be active, LOW for data to be read out on the rising edge of RCLK. In the FWFT mode, the first word written to an empty FIFO automatically goes to the outputs Qn, on the third valid LOW-to-HIGH transition of RCLK + tSKEW after the first write. REN and RCS do not need to be asserted LOW for the First Word to fall through to the output register. In order to access all other words, a read must be executed using REN and RCS. The RCLK LOW-to-HIGH transition after the last word has been read from the FIFO, Output Ready (OR) will go HIGH with a true read (RCLK with REN = LOW;RCS = LOW), inhibiting further read operations. REN is ignored when the FIFO is empty. If Asynchronous operation of the Read port has been selected, then REN must be held active, (tied LOW). SERIAL ENABLE ( SEN ) The SEN input is an enable used only for serial programming of the offset registers. The serial programming method must be selected during Master Reset. SEN is always used in conjunction with LD. When these lines are both LOW, data at the SI input can be loaded into the program register one bit for each LOW-to-HIGH transition of SCLK. When SEN is HIGH, the programmable registers retains the previous settings and no offsets are loaded. SEN functions the same way in both IDT Standard and FWFT modes. OUTPUT ENABLE ( OE ) When Output Enable is enabled (LOW), the parallel output buffers receive data from the output register. When OE is HIGH, the output data bus (Qn) goes
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
into a high impedance state. During Master or a Partial Reset the OE is the only input that can place the output bus Qn, into High-Impedance. During Reset the RCS input can be HIGH or LOW, it has no effect on the Qn outputs. READ CHIP SELECT ( RCS ) The Read Chip Select input provides synchronous control of the Read output port. When RCS goes LOW, the next rising edge of RCLK causes the Qn outputs to go to the Low-Impedance state. When RCS goes HIGH, the next RCLK rising edge causes the Qn outputs to return to HIGH Z. During a Master or Partial Reset the RCS input has no effect on the Qn output bus, OE is the only input that provides High-Impedance control of the Qn outputs. If OE is LOW the Qn data outputs will be Low-Impedance regardless of RCS until the first rising edge of RCLK after a Reset is complete. Then if RCS is HIGH the data outputs will go to High-Impedance. The RCS input does not effect the operation of the flags. For example, when the first word is written to an empty FIFO, the EF will still go from LOW to HIGH based on a rising edge of RCLK, regardless of the state of the RCS input. Also, when operating the FIFO in FWFT mode the first word written to an empty FIFO will still be clocked through to the output register based on RCLK, regardless of the state of RCS. For this reason the user must take care when a data word is written to an empty FIFO in FWFT mode. If RCS is disabled when an empty FIFO is written into, the first word will fall through to the output register, but will not be available on the Qn outputs which are in HIGH-Z. The user must take RCS active LOW to access this first word, place the output bus in LOW-Z. REN must remain disabled HIGH for at least one cycle after RCS has gone LOW. A rising edge of RCLK with RCS and REN active LOW, will read out the next word. Care must be taken so as not to lose the first word written to an empty FIFO when RCS is HIGH. Refer to Figure 17, RCS and REN Read Operation (FWFT Mode). The RCS pin must also be active (LOW) in order to perform a Retransmit. See Figure 13 for Read Cycle and Read Chip Select Timing (IDT Standard Mode). See Figure 16 for Read Cycle and Read Chip Select Timing (First Word Fall Through Mode). If Asynchronous operation of the Read port has been selected, then RCS must be held active, (tied LOW). OE provides three-state control of Qn. WRITE PORT HSTL SELECT (WHSTL) The control inputs, data inputs and flag outputs associated with the write port can be setup to be either HSTL or LVTTL. If WHSTL is HIGH during the Master Reset, then HSTL operation of the write port will be selected. If WHSTL is LOW at Master Reset, then LVTTL will be selected. The inputs and outputs associated with the write port are listed in Table 5. READ PORT HSTL SELECT (RHSTL) The control inputs, data inputs and flag outputs associated with the read port can be setup to be either HSTL or LVTTL. If RHSTL is HIGH during the Master Reset, then HSTL operation of the read port will be selected. If RHSTL is LOW at Master Reset, then LVTTL will be selected for the read port, then echo clock and echo read enable will not be provided. The inputs and outputs associated with the read port are listed in Table 5. SYSTEM HSTL SELECT (SHSTL) All inputs not associated with the write and read port can be setup to be either HSTL or LVTTL. If SHSTL is HIGH during Master Reset, then HSTL operation of all the inputs not associated with the write and read port will be selected. If SHSTL is LOW at Master Reset, then LVTTL will be selected. The inputs associated with SHSTL are listed in Table 5.
LOAD (LD) This is a dual purpose pin. During Master Reset, the state of the LD input, along with FSEL0 and FSEL1, determines one of eight default offset values for the PAE and PAF flags, along with the method by which these offset registers can be programmed, parallel or serial (see Table 2). After Master Reset, LD enables write operations to and read operations from the offset registers. Only the offset loading method currently selected can be used to write to the registers. Offset registers can be read only in parallel. After Master Reset, the LD pin is used to activate the programming process of the flag offset values PAE and PAF. Pulling LD LOW will begin a serial loading or parallel load or read of these offset values. THIS PIN MUST BE HIGH AFTER MASTER RESET TO WRITE OR READ DATA TO/FROM THE FIFO MEMORY. BUS-MATCHING (BM, IW, OW) The pins BM, IW and OW are used to define the input and output bus widths. During Master Reset, the state of these pins is used to configure the device bus sizes. See Table 1 for control settings. All flags will operate on the word/byte size boundary as defined by the selection of bus width. See Figure 5 for BusMatching Byte Arrangement. BIG-ENDIAN/LITTLE-ENDIAN ( BE ) During Master Reset, a LOW on BE will select Big-Endian operation. A HIGH on BE during Master Reset will select Little-Endian format. This function is useful when the following input to output bus widths are implemented: x36 to x18, x36 to x9, x18 to x36 and x9 to x36. If Big-Endian mode is selected, then the most significant byte (word) of the long word written into the FIFO will be read out of the FIFO first, followed by the least significant byte. If Little-Endian format is selected, then the least significant byte of the long word written into the FIFO will be read out first, followed by the most significant byte. The mode desired is configured during master reset by the state of the Big-Endian (BE) pin. See Figure 5 for Bus-Matching Byte Arrangement. PROGRAMMABLE FLAG MODE (PFM) During Master Reset, a LOW on PFM will select Asynchronous Programmable flag timing mode. A HIGH on PFM will select Synchronous Programmable flag timing mode. If asynchronous PAF/PAE configuration is selected (PFM, LOW during MRS), the PAE is asserted LOW on the LOW-to-HIGH transition of RCLK. PAE is reset to HIGH on the LOW-to-HIGH transition of WCLK. Similarly, the PAF is asserted LOW on the LOW-to-HIGH transition of WCLK and PAF is reset to HIGH on the LOW-to-HIGH transition of RCLK. If synchronous PAE/PAF configuration is selected (PFM, HIGH during MRS) , the PAE is asserted and updated on the rising edge of RCLK only and not WCLK. Similarly, PAF is asserted and updated on the rising edge of WCLK only and not RCLK. The mode desired is configured during master reset by the state of the Programmable Flag Mode (PFM) pin. INTERSPERSED PARITY (IP) During Master Reset, a LOW on IP will select Non-Interspersed Parity mode. A HIGH will select Interspersed Parity mode. The IP bit function allows the user to select the parity bit in the word loaded into the parallel port (D0-Dn) when programming the flag offsets. If Interspersed Parity mode is selected, then the FIFO will assume that the parity bits are located in bit position D8, D17, D26 and D35 during the parallel programming of the flag offsets. If Non-Interspersed Parity mode is selected, then D8, D17 and D28 are is assumed to be valid bits and D32, D33, D34 and D35 are ignored. IP mode is selected during Master Reset by the state of the IP input pin.
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
OUTPUTS:
FULL FLAG ( FF/IR ) This is a dual purpose pin. In IDT Standard mode, the Full Flag (FF) function is selected. When the FIFO is full, FF will go LOW, inhibiting further write operations. When FF is HIGH, the FIFO is not full. If no reads are performed after a reset (either MRS or PRS), FF will go LOW after D writes to the FIFO (D = 1,024 for the IDT72T3645, 2,048 for the IDT72T3655, 4,096 for the IDT72T3665, 8,192 for the IDT72T3675, 16,384 for the IDT72T3685, 32,768 for the IDT72T3695, 65,536 for the IDT72T36105, 131,072 for the IDT72T36115 and 262,144 for the IDT72T36125). See Figure 11, Write Cycle and Full Flag Timing (IDT Standard Mode), for the relevant timing information. In FWFT mode, the Input Ready (IR) function is selected. IR goes LOW when memory space is available for writing in data. When there is no longer any free space left, IR goes HIGH, inhibiting further write operations. If no reads are performed after a reset (either MRS or PRS), IR will go HIGH after D writes to the FIFO (D = 1,025 for the IDT72T3645, 2,049 for the IDT72T3655, 4,097 for the IDT72T3665, 8,193 for the IDT72T3675, 16,385 for the IDT72T3685, 32,769 for the IDT72T3695, 65,537 for the IDT72T36105, 131,073 for the IDT72T36115 and 262,145 for the IDT72T36125). See Figure 14, Write Timing (FWFT Mode), for the relevant timing information. The IR status not only measures the contents of the FIFO memory, but also counts the presence of a word in the output register. Thus, in FWFT mode, the total number of writes necessary to deassert IR is one greater than needed to assert FF in IDT Standard mode. FF/IR is synchronous and updated on the rising edge of WCLK. FF/IR are double register-buffered outputs. Note, when the device is in Retransmit mode, this flag is a comparison of the write pointer to the `marked' location. This differs from normal mode where this flag is a comparison of the write pointer to the read pointer. EMPTY FLAG ( EF/OR ) This is a dual purpose pin. In the IDT Standard mode, the Empty Flag (EF) function is selected. When the FIFO is empty, EF will go LOW, inhibiting further read operations. When EF is HIGH, the FIFO is not empty. See Figure 12, Read Cycle, Empty Flag and First Word Latency Timing (IDT Standard Mode), for the relevant timing information. In FWFT mode, the Output Ready (OR) function is selected. OR goes LOW at the same time that the first word written to an empty FIFO appears valid on the outputs. OR stays LOW after the RCLK LOW to HIGH transition that shifts the last word from the FIFO memory to the outputs. OR goes HIGH only with a true read (RCLK with REN = LOW). The previous data stays at the outputs, indicating the last word was read. Further data reads are inhibited until OR goes LOW again. See Figure 15, Read Timing (FWFT Mode), for the relevant timing information. EF/OR is synchronous and updated on the rising edge of RCLK. In IDT Standard mode, EF is a double register-buffered output. In FWFT mode, OR is a triple register-buffered output. PROGRAMMABLE ALMOST-FULL FLAG ( PAF ) The Programmable Almost-Full flag (PAF) will go LOW when the FIFO reaches the almost-full condition. In IDT Standard mode, if no reads are performed after reset (MRS), PAF will go LOW after (D - m) words are written to the FIFO. The PAF will go LOW after (1,024-m) writes for the IDT72T3645, (2,048-m) writes for the IDT72T3655, (4,096-m) writes for the IDT72T3665, (8,192-m) writes for the IDT72T3675, (16,384-m) writes for the IDT72T3685, (32,768-m) writes for the IDT72T3695, (65,536-m) writes for the IDT72T36105, (131,072-m) writes for the IDT72T36115 and (262,144-m) writes for the
27
IDT72T36125. The offset "m" is the full offset value. The default setting for this value is stated in the footnote of Table 3. In FWFT mode, the PAF will go LOW after (1,025-m) writes for the IDT72T3645, (2,049-m) writes for the IDT72T3655, (4,097-m) writes for the IDT72T3665 and (8,193-m) writes for the IDT72T3675, (16,385-m) writes for the IDT72T3685, (32,769-m) writes for the IDT72T3695, (65,537-m) writes for the IDT72T36105, (131,073-m) writes for the IDT72T36115 and (262,145-m) writes for the IDT72T36125, where m is the full offset value. The default setting for this value is stated in Table 4. See Figure 23, Synchronous Programmable Almost-Full Flag Timing (IDT Standard and FWFT Mode), for the relevant timing information. If asynchronous PAF configuration is selected, the PAF is asserted LOW on the LOW-to-HIGH transition of the Write Clock (WCLK). PAF is reset to HIGH on the LOW-to-HIGH transition of the Read Clock (RCLK). If synchronous PAF configuration is selected, the PAF is updated on the rising edge of WCLK. See Figure 25, Asynchronous Almost-Full Flag Timing (IDT Standard and FWFT Mode). Note, when the device is in Retransmit mode, this flag is a comparison of the write pointer to the `marked' location. This differs from normal mode where this flag is a comparison of the write pointer to the read pointer. PROGRAMMABLE ALMOST-EMPTY FLAG ( PAE ) The Programmable Almost-Empty flag (PAE) will go LOW when the FIFO reaches the almost-empty condition. In IDT Standard mode, PAE will go LOW when there are n words or less in the FIFO. The offset "n" is the empty offset value. The default setting for this value is stated in the footnote of Table 1. In FWFT mode, the PAE will go LOW when there are n+1 words or less in the FIFO. The default setting for this value is stated in Table 2. See Figure 24, Synchronous Programmable Almost-Empty Flag Timing (IDT Standard and FWFT Mode), for the relevant timing information. If asynchronous PAE configuration is selected, the PAE is asserted LOW on the LOW-to-HIGH transition of the Read Clock (RCLK). PAE is reset to HIGH on the LOW-to-HIGH transition of the Write Clock (WCLK). If synchronous PAE configuration is selected, the PAE is updated on the rising edge of RCLK. See Figure 26, Asynchronous Programmable Almost-Empty Flag Timing (IDT Standard and FWFT Mode). HALF-FULL FLAG ( HF ) This output indicates a half-full FIFO. The rising WCLK edge that fills the FIFO beyond half-full sets HF LOW. The flag remains LOW until the difference between the write and read pointers becomes less than or equal to half of the total depth of the device; the rising RCLK edge that accomplishes this condition sets HF HIGH. In IDT Standard mode, if no reads are performed after reset (MRS or PRS), HF will go LOW after (D/2 + 1) writes to the FIFO, where D = 1,024 for the IDT72T3645, 2,048 for the IDT72T3655, 4,096 for the IDT72T3665, 8,192 for the IDT72T3675, 16,384 for the IDT72T3685, 32,768 for the IDT72T3695, 65,536 for the IDT72T36105, 131,072 for the IDT72T36115 and 262,144 for the IDT72T36125. In FWFT mode, if no reads are performed after reset (MRS or PRS), HF will go LOW after (D-1/2 + 2) writes to the FIFO, where D = 1,025 for the IDT72T3645, 2,049 for the IDT72T3655, 4,097 for the IDT72T3665, 8,193 for the IDT72T3675, 16,385 for the IDT72T3685, 32,769 for the IDT72T3695, 65,537 for the IDT72T36105, 131,073 for the IDT72T36115 and 262,145 for the IDT72T36125. See Figure 27, Half-Full Flag Timing (IDT Standard and FWFT Modes), for the relevant timing information. Because HF is updated by both RCLK and WCLK, it is considered asynchronous.
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
ECHO READ CLOCK (ERCLK) The Echo Read Clock output is provided in both HSTL and LVTTL mode, selectable via RHSTL. The ERCLK is a free-running clock output, it will always follow the RCLK input regardless of REN and RCS. The ERCLK output follows the RCLK input with an associated delay. This delay provides the user with a more effective read clock source when reading data from the Qn outputs. This is especially helpful at high speeds when variables within the device may cause changes in the data access times. These variations in access time maybe caused by ambient temperature, supply voltage, device characteristics. The ERCLK output also compensates for any trace length delays between the Qn data outputs and receiving devices inputs. Any variations effecting the data access time will also have a corresponding effect on the ERCLK output produced by the FIFO device, therefore the ERCLK output level transitions should always be at the same position in time relative to the data outputs. Note, that ERCLK is guaranteed by design to be slower than the slowest Qn, data output. Refer to Figure 4, Echo Read Clock and Data Output Relationship, Figure 28, Echo Read Clock & Read Enable Operation and Figure 29, Echo RCLK & Echo REN Operation for timing information.
ECHO READ ENABLE (EREN) The Echo Read Enable output is provided in both HSTL and LVTTL mode, selectable via RHSTL. The EREN output is provided to be used in conjunction with the ERCLK output and provides the reading device with a more effective scheme for reading data from the Qn output port at high speeds. The EREN output is controlled by internal logic that behaves as follows: The EREN output is active LOW for the RCLK cycle that a new word is read out of the FIFO. That is, a rising edge of RCLK will cause EREN to go active, LOW if both REN and RCS are active, LOW and the FIFO is NOT empty. SERIAL CLOCK (SCLK) During serial loading of the programming flag offset registers, a rising edge on the SCLK input is used to load serial data present on the SI input provided that the SEN input is LOW. DATA OUTPUTS (Q0-Qn) (Q0-Q35) are data outputs for 36-bit wide data, (Q0 - Q17) are data outputs for 18-bit wide data or (Q0-Q8) are data outputs for 9-bit wide data.
RCLK
tERCLK tERCLK
ERCLK
tA
tD
QSLOWEST(3)
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NOTES: 1. REN is LOW. 2. tERCLK > tA, guaranteed by design. 3. Qslowest is the data output with the slowest access time, tA. 4. Time, tD is greater than zero, guaranteed by design.
Figure 4. Echo Read Clock and Data Output Relationship
28
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
BYTE ORDER ON INPUT PORT: D35-D27 D26-D18 D17-D9 D8-D0
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
A
B
C
D
Write to FIFO
BYTE ORDER ON OUTPUT PORT:
Q35-Q27
Q26-Q18
Q17-Q9
Q8-Q0
BE X
BM L
IW L
OW L
A
B
C
D
Read from FIFO
(a) x36 INPUT to x36 OUTPUT
Q35-Q27
Q26-Q18
Q17-Q9
Q8-Q0
BE L
BM H
IW L
OW L
Q35-Q27 Q26-Q18
A
Q17-Q9
B
Q8-Q0
1st: Read from FIFO
C
(b) x36 INPUT to x18 OUTPUT - BIG-ENDIAN
D
2nd: Read from FIFO
Q35-Q27
Q26-Q18
Q17-Q9
Q8-Q0
BE H
BM H
IW L
OW L
Q35-Q27 Q26-Q18
C
Q17-Q9
D
Q8-Q0
1st: Read from FIFO
A
(c) x36 INPUT to x18 OUTPUT - LITTLE-ENDIAN
B
2nd: Read from FIFO
Q35-Q27
Q26-Q18
Q17-Q9
Q8-Q0
BE L
BM H
IW L
OW H
Q35-Q27 Q26-Q18 Q17-Q9
A
Q8-Q0
1st: Read from FIFO
B
Q35-Q27 Q26-Q18 Q17-Q9 Q8-Q0
2nd: Read from FIFO
C
Q35-Q27 Q26-Q18 Q17-Q9 Q8-Q0
3rd: Read from FIFO
D
(d) x36 INPUT to x9 OUTPUT - BIG-ENDIAN
4th: Read from FIFO
Q35-Q27
Q26-Q18
Q17-Q9
Q8-Q0
BE H
BM H
IW L
OW H
Q35-Q27 Q26-Q18 Q17-Q9
D
Q8-Q0
1st: Read from FIFO
C
Q35-Q27 Q26-Q18 Q17-Q9 Q8-Q0
2nd: Read from FIFO
B
Q35-Q27 Q26-Q18 Q17-Q9 Q8-Q0
3rd: Read from FIFO
A
(e) x36 INPUT to x9 OUTPUT - LITTLE-ENDIAN
4th: Read from FIFO
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Figure 5. Bus-Matching Byte Arrangement
29
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
BYTE ORDER ON INPUT PORT: D35-D27 D26-D18 D17-D9 D8-D0
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
A
D35-D27 D26-D18 D17-D9
B
D8-D0
1st: Write to FIFO
C
D
2nd: Write to FIFO
BYTE ORDER ON OUTPUT PORT:
Q35-Q27
Q26-Q18
Q17-Q9
Q8-Q0
BE L
BM H
IW H
OW L
A
B
C
D
Read from FIFO
(a) x18 INPUT to x36 OUTPUT - BIG-ENDIAN
Q35-Q27
Q26-Q18
Q17-Q9
Q8-Q0
BE H
BM H
IW H
OW L
C
D
A
B
Read from FIFO
(b) x18 INPUT to x36 OUTPUT - LITTLE-ENDIAN
BYTE ORDER ON INPUT PORT:
D35-D27
D26-D18
D17-D9
D8-D0
A
D35-D27 D26-D18 D17-D9 D8-D0
1st: Write to FIFO
B
D35-D27 D26-D18 D17-D9 D8-D0
2nd: Write to FIFO
C
D35-D27 D26-D18 D17-D9 D8-D0
3rd: Write to FIFO
D
4th: Write to FIFO
BYTE ORDER ON OUTPUT PORT:
Q35-Q27
Q26-Q18
Q17-Q9
Q8-Q0
BE L
BM H
IW H
OW H
A
B
C
D
Read from FIFO
(a) x9 INPUT to x36 OUTPUT - BIG-ENDIAN
Q35-Q27
Q26-Q18
Q17-Q9
Q8-Q0
BE H
BM H
IW H
OW H
D
C
B
A
Read from FIFO
(b) x9 INPUT to x36 OUTPUT - LITTLE-ENDIAN
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Figure 5. Bus-Matching Byte Arrangement (Continued)
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
JTAG TIMING SPECIFICATION
tTCK t4 t1
TCK
t2
t3
TDI/ TMS
tDS
TDO
tDH
TDO
t6
TRST
Notes to diagram: t1 = tTCKLOW t2 = tTCKHIGH t3 = tTCKFALL t4 = tTCKRISE t5 = tRST (reset pulse width) t6 = tRSR (reset recovery)
tDO
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t5
Figure 6. Standard JTAG Timing
SYSTEM INTERFACE PARAMETERS
IDT72T3645 IDT72T3655 IDT72T3665 IDT72T3675 IDT72T3685 IDT72T3695 IDT72T36105 IDT72T36115 IDT72T36125 Parameter Data Output Data Output Hold Data Input Symbol tDO(1) tDOH(1) tDS tDH trise=3ns tfall=3ns Test Conditions Min. 0 10 10 Max. Units 20 -
JTAG AC ELECTRICAL CHARACTERISTICS
(vcc = 2.5V 5%; Tcase = 0C to +85C)
Parameter Symbol Test Conditions Min. JTAG Clock Input Period tTCK JTAG Clock HIGH JTAG Clock Low JTAG Clock Rise Time JTAG Clock Fall Time JTAG Reset JTAG Reset Recovery
NOTE: 1. Guaranteed by design.
Max. Units 5(1) 5
(1)
-
100 40 40 50 50
ns ns ns ns ns ns ns
tTCKHIGH tTCKLOW tTCKRISE tTCKFALL tRST tRSR
ns ns ns
-
NOTE: 1. 50pf loading on external output signals.
31
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
JTAG INTERFACE
Five additional pins (TDI, TDO, TMS, TCK and TRST) are provided to support the JTAG boundary scan interface. The IDT72T3645/72T3655/ 72T3665/72T3675/72T3685/72T3695/72T36105/72T36115/72T36125 incorporates the necessary tap controller and modified pad cells to implement the JTAG facility. Note that IDT provides appropriate Boundary Scan Description Language program files for these devices.
* * * *
The Standard JTAG interface consists of four basic elements: Test Access Port (TAP) TAP controller Instruction Register (IR) Data Register Port (DR)
The following sections provide a brief description of each element. For a complete description refer to the IEEE Standard Test Access Port Specification (IEEE Std. 1149.1-1990). The Figure below shows the standard Boundary-Scan Architecture
DeviceID Reg. Boundary Scan Reg. Bypass Reg.
Mux
TDO TDI
T A
TMS TCLK TRST
P TAP Controller
clkDR, ShiftDR UpdateDR
Instruction Decode clklR, ShiftlR UpdatelR Instruction Register
Control Signals
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Figure 7. Boundary Scan Architecture
TEST ACCESS PORT (TAP) The Tap interface is a general-purpose port that provides access to the internal of the processor. It consists of four input ports (TCLK, TMS, TDI, TRST) and one output port (TDO).
32
THE TAP CONTROLLER The Tap controller is a synchronous finite state machine that responds to TMS and TCLK signals to generate clock and control signals to the Instruction and Data Registers for capture and update of data.
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
Test-Logic Reset 0 1 1 1 SelectIR-Scan 1 0 Capture-IR 0 Shift-IR 1 Exit1-IR 0 Pause-IR 1 0 Exit2-IR 1 Update-IR 1 0
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0
Run-Test/ Idle
SelectDR-Scan 0 1 Capture-DR 00 Shift-DR 1
0
Input = TMS
EXit1-DR 00 Pause-DR 1 0 Exit2-DR 1 Update-DR 1 0
1
1
0
NOTES: 1. Five consecutive TCK cycles with TMS = 1 will reset the TAP. 2. TAP controller does not automatically reset upon power-up. The user must provide a reset to the TAP controller (either by TRST or TMS). 3. TAP controller must be reset before normal FIFO operations can begin.
Figure 8. TAP Controller State Diagram
Refer to the IEEE Standard Test Access Port Specification (IEEE Std. 1149.1) for the full state diagram All state transitions within the TAP controller occur at the rising edge of the TCLK pulse. The TMS signal level (0 or 1) determines the state progression that occurs on each TCLK rising edge. The TAP controller takes precedence over the FIFO memory and must be reset after power up of the device. See TRST description for more details on TAP controller reset. Test-Logic-Reset All test logic is disabled in this controller state enabling the normal operation of the IC. The TAP controller state machine is designed in such a way that, no matter what the initial state of the controller is, the Test-Logic-Reset state can be entered by holding TMS at high and pulsing TCK five times. This is the reason why the Test Reset (TRST) pin is optional. Run-Test-Idle In this controller state, the test logic in the IC is active only if certain instructions are present. For example, if an instruction activates the self test, then it will be executed when the controller enters this state. The test logic in the IC is idles otherwise. Select-DR-Scan This is a controller state where the decision to enter the Data Path or the Select-IR-Scan state is made. Select-IR-Scan This is a controller state where the decision to enter the Instruction Path is made. The Controller can return to the Test-Logic-Reset state other wise.
33
Capture-IR In this controller state, the shift register bank in the Instruction Register parallel loads a pattern of fixed values on the rising edge of TCK. The last two significant bits are always required to be "01". Shift-IR In this controller state, the instruction register gets connected between TDI and TDO, and the captured pattern gets shifted on each rising edge of TCK. The instruction available on the TDI pin is also shifted in to the instruction register. Exit1-IR This is a controller state where a decision to enter either the PauseIR state or Update-IR state is made. Pause-IR This state is provided in order to allow the shifting of instruction register to be temporarily halted. Exit2-DR This is a controller state where a decision to enter either the ShiftIR state or Update-IR state is made. Update-IR In this controller state, the instruction in the instruction register is latched in to the latch bank of the Instruction Register on every falling edge of TCK. This instruction also becomes the current instruction once it is latched. Capture-DR In this controller state, the data is parallel loaded in to the data registers selected by the current instruction on the rising edge of TCK. Shift-DR, Exit1-DR, Pause-DR, Exit2-DR and Update-DR These controller states are similar to the Shift-IR, Exit1-IR, Pause-IR, Exit2-IR and Update-IR states in the Instruction path.
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
THE INSTRUCTION REGISTER The Instruction register allows an instruction to be shifted in serially into the processor at the rising edge of TCLK. The Instruction is used to select the test to be performed, or the test data register to be accessed, or both. The instruction shifted into the register is latched at the completion of the shifting process when the TAP controller is at UpdateIR state. The instruction register must contain 4 bit instruction register-based cells which can hold instruction data. These mandatory cells are located nearest the serial outputs they are the least significant bits. TEST DATA REGISTER The Test Data register contains three test data registers: the Bypass, the Boundary Scan register and Device ID register. These registers are connected in parallel between a common serial input and a common serial data output. The following sections provide a brief description of each element. For a complete description, refer to the IEEE Standard Test Access Port Specification (IEEE Std. 1149.1-1990). TEST BYPASS REGISTER The register is used to allow test data to flow through the device from TDI to TDO. It contains a single stage shift register for a minimum length in serial path. When the bypass register is selected by an instruction, the shift register stage is set to a logic zero on the rising edge of TCLK when the TAP controller is in the Capture-DR state. The operation of the bypass register should not have any effect on the operation of the device in response to the BYPASS instruction. THE BOUNDARY-SCAN REGISTER The Boundary Scan Register allows serial data TDI be loaded in to or read out of the processor input/output ports. The Boundary Scan Register is a part of the IEEE 1149.1-1990 Standard JTAG Implementation. THE DEVICE IDENTIFICATION REGISTER The Device Identification Register is a Read Only 32-bit register used to specify the manufacturer, part number and version of the processor to be determined through the TAP in response to the IDCODE instruction. IDT JEDEC ID number is 0xB3. This translates to 0x33 when the parity is dropped in the 11-bit Manufacturer ID field. For the IDT72T3645/72T3655/72T3665/72T3675/72T3685/72T3695/ 72T36105/72T36115/72T36125, the Part Number field contains the following values: Device Part# Field IDT72T3645 0405 IDT72T3655 0404 IDT72T3665 0403 IDT72T3675 0402 IDT72T3685 0401 IDT72T3695 0400 IDT72T36105 0416 IDT72T36115 0415 IDT72T36125 0414
31(MSB) 28 27 12 11 1 0(LSB) Version (4 bits) Part Number (16-bit) Manufacturer ID (11-bit) 0X0 0X33 1
IDT72T3645/55/65/75/85/95/105/115/125 JTAG Device Identification Register
JTAG INSTRUCTION REGISTER The Instruction register allows instruction to be serially input into the device when the TAP controller is in the Shift-IR state. The instruction is decoded to perform the following: * Select test data registers that may operate while the instruction is current. The other test data registers should not interfere with chip operation and the selected data register. * Define the serial test data register path that is used to shift data between TDI and TDO during data register scanning. The Instruction Register is a 4 bit field (i.e.IR3, IR2, IR1, IR0) to decode 16 different possible instructions. Instructions are decoded as follows. Hex Value 0x00 0x02 0x01 0x03 0x0F Instruction EXTEST IDCODE SAMPLE/PRELOAD HIGH-IMPEDANCE BYPASS Function Select Boundary Scan Register Select Chip Identification data register Select Boundary Scan Register JTAG Select Bypass Register
JTAG Instruction Register Decoding
The following sections provide a brief description of each instruction. For a complete description refer to the IEEE Standard Test Access Port Specification (IEEE Std. 1149.1-1990). EXTEST The required EXTEST instruction places the IC into an external boundarytest mode and selects the boundary-scan register to be connected between TDI and TDO. During this instruction, the boundary-scan register is accessed to drive test data off-chip via the boundary outputs and receive test data off-chip via the boundary inputs. As such, the EXTEST instruction is the workhorse of IEEE. Std 1149.1, providing for probe-less testing of solder-joint opens/shorts and of logic cluster function. IDCODE The optional IDCODE instruction allows the IC to remain in its functional mode and selects the optional device identification register to be connected between TDI and TDO. The device identification register is a 32-bit shift register containing information regarding the IC manufacturer, device type, and version code. Accessing the device identification register does not interfere with the operation of the IC. Also, access to the device identification register should be immediately available, via a TAP data-scan operation, after power-up of the IC or after the TAP has been reset using the optional TRST pin or by otherwise moving to the Test-Logic-Reset state. SAMPLE/PRELOAD The required SAMPLE/PRELOAD instruction allows the IC to remain in a normal functional mode and selects the boundary-scan register to be connected between TDI and TDO. During this instruction, the boundary-scan register can be accessed via a date scan operation, to take a sample of the functional data entering and leaving the IC. This instruction is also used to preload test data into the boundary-scan register before loading an EXTEST instruction.
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
HIGH-IMPEDANCE The optional High-Impedance instruction sets all outputs (including two-state as well as three-state types) of an IC to a disabled (high-impedance) state and selects the one-bit bypass register to be connected between TDI and TDO. During this instruction, data can be shifted through the bypass register from TDI to TDO without affecting the condition of the IC outputs.
BYPASS The required BYPASS instruction allows the IC to remain in a normal functional mode and selects the one-bit bypass register to be connected between TDI and TDO. The BYPASS instruction allows serial data to be transferred through the IC from TDI to TDO without affecting the operation of the IC.
35
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
tRS MRS tRSS REN tRSS WEN tRSS FWFT/SI tRSS LD tRSS FSEL0, FSEL1 tRSS OW, IW, BM tHRSS WHSTL tHRSS RHSTL tHRSS SHSTL tRSS BE tRSS PFM tRSS IP tRSS RT tRSS SEN tRSF EF/OR tRSF FF/IR tRSF PAE tRSF PAF, HF tRSF Q0 - Qn tRSR tRSR tRSR tRSR
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
If FWFT = HIGH, OR = HIGH If FWFT = LOW, EF = LOW If FWFT = LOW, FF = HIGH If FWFT = HIGH, IR = LOW
OE = HIGH OE = LOW
5907 drw14
NOTE: 1. During Master Reset the High-Impedance control of the Qn data outputs is provided by OE only, RCS can be HIGH or LOW until the first rising edge of RCLK after Master Reset is complete.
Figure 9. Master Reset Timing
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
PRS tRSS REN tRSS WEN tRSS RT tRSS SEN
tRS tRSR
tRSR
tRSF EF/OR tRSF FF/IR tRSF PAE tRSF PAF, HF tRSF Q0 - Qn
If FWFT = HIGH, OR = HIGH If FWFT = LOW, EF = LOW If FWFT = LOW, FF = HIGH If FWFT = HIGH, IR = LOW
OE = HIGH OE = LOW
5907 drw15
NOTE: 1. During Partial Reset the High-Impedance control of the Qn data outputs is provided by OE only, RCS can be HIGH or LOW until the first rising edge of RCLK after Master Reset is complete.
Figure 10. Partial Reset Timing
37
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
tCLKH 2 tDS DX tWFF FF tWFF tDH tCLK tCLKL tSKEW1
(1)
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
NO WRITE
NO WRITE
WCLK D0 - Dn
tSKEW1
(1)
1
1
2
tDS DX+1 tWFF
tDH
tWFF
WEN RCLK tENS REN tENS RCS tA Q0 - Qn tRCSLZ
NOTES: 1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that FF will go HIGH (after one WCLK cycle pus tWFF). If the time between the rising edge of the RCLK and the rising edge of the WCLK is less than tSKEW1, then the FF deassertion may be delayed one extra WCLK cycle. 2. LD = HIGH, OE = LOW, EF = HIGH. 3. WCS = LOW.
DATA READ
tENH
tENS
tENH
tA
NEXT DATA READ
5907 drw16
Figure 11. Write Cycle and Full Flag Timing (IDT Standard Mode)
tCLKH
tCLK
tCLKL tENS tENH tENS tENH
RCLK
tENS tENH
1
2
REN
tREF
NO OPERATION
NO OPERATION
tREF tA LAST WORD LAST WORD tOHZ
(1)
tREF
EF
tA tA D0 D1
Q0 - Qn
tOLZ tOE
tOLZ
OE
tSKEW1
WCLK
tENS tENH tENS tENH
WEN
tWCSS tWCSH tDH tDS D1
5907 drw17
WCS
tDS tDH
D0 - Dn
D0
NOTES: 1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the rising edge of WCLK and the rising edge of RCLK is less than tSKEW1, then EF deassertion may be delayed one extra RCLK cycle. 2. LD = HIGH. 3. First data word latency = tSKEW1 + 1*TRCLK + tREF. 4. RCS is LOW.
Figure 12. Read Cycle, Output Enable, Empty Flag and First Data Word Latency (IDT Standard Mode)
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
1
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
2
RCLK
tENS
REN
tENS tENH tENS tENS tREF
RCS
tREF tRCSHZ LAST DATA tSKEW1(1)
EF
tRCSLZ tA LAST DATA-1
tRCSHZ tRCSLZ
tA
Q0 - Qn WCLK
tENS
tENH
WEN
tDS tDH Dx
5907 drw 18
Dn
NOTES: 1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between the rising edge of WCLK and the rising edge of RCLK is less than tSKEW1, then EF deassertion may be delayed one extra RCLK cycle. 2. LD = HIGH. 3. First data word latency = tSKEW1 + 1*TRCLK + tREF. 4. OE is LOW.
Figure 13. Read Cycle and Read Chip Select (IDT Standard Mode)
39
WCLK
1
WEN tDS W3 W4 tSKEW2(2)
2 3 1 2
tENS tDS W[n +2] W[n+3] W[n+4] W[D-m-2] W[D-m-1] W[D-m] W[D-m+1] W[D-m+2] W[D-1] W[
D-1
tDS
tDH
tDS W[
D-1
tENH WD
D0 - Dn
W1
W2
]
]
W[
D-1
]
tSKEW1(1)
RCLK
1
RCS
tENS
REN tRCSLZ tA W1 tREF
Q0 - Qn
PREVIOUS DATA IN OUTPUT REGISTER
OR
PAE
tPAES
HF
tHF
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
40
tPAFS tWFF
5907 drw 19
PAF
IR
NOTES: 1. tSKEW1 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that OR will go LOW after two RCLK cycles plus tREF. If the time between the rising edge of WCLK and the rising edge of RCLK is less than tSKEW1, then OR assertion may be delayed one extra RCLK cycle. 2. tSKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that PAE will go HIGH after one RCLK cycle plus tPAES. If the time between the rising edge of WCLK and the rising edge of RCLK is less than tSKEW2, then the PAE deassertion may be delayed one extra RCLK cycle. 3. LD = HIGH, OE = LOW 4. n = PAE offset, m = PAF offset and D = maximum FIFO depth. 5. D = 1,025 for IDT72T3645, 2,049 for IDT72T3655, 4,097 for IDT72T3665, 8,193 for IDT72T3675, 16,385 for IDT72T3685, 32,769 for the IDT72T3695, 65,537 for the IDT72T36105, 131,073 for the IDT72T36115 and 262,145 for the IDT72T36125. 6. First data word latency = tSKEW1 + 2*TRCLK + tREF.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
Figure 14. Write Timing (First Word Fall Through Mode)
WCLK 2 tSKEW2
(2)
tENS
tENH
1 (1) tSKEW1
WEN
tDS
tDH
D0 - Dn
WD
RCLK
1
tENS
tENS
REN
OE tA tA tA W3 W[D-1] Wm+2 W[m+3] W[m+4] W[D-n-1] W[D-n+1] W[D-n+2] W[D-n] W[
D-1
tOHZ tA tA
D-1
tOE tA W2
Q0 - Qn
W1
W1
]
W[
]
WD tREF
OR tPAES
PAE
HF tPAFS
tHF
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
41
tWFF
PAF
tWFF
IR
5907 drw20
NOTES: 1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that IR will go LOW after one WCLK cycle plus tWFF. If the time between the rising edge of RCLK and the rising edge of WCLK is less than tSKEW1, then the IR assertion may be delayed one extra WCLK cycle. 2. tSKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that PAF will go HIGH after one WCLK cycle plus tPAFS. If the time between the rising edge of RCLK and the rising edge of WCLK is less than tSKEW2, then the PAF deassertion may be delayed one extra WCLK cycle. 3. LD = HIGH. 4. n = PAE Offset, m = PAF offset and D = maximum FIFO depth. 5. D = 1,025 for IDT72T3645, 2,049 for IDT72T3655, 4,097 for IDT72T3665, 8,193 for IDT72T3675, 16,385 for IDT72T3685, 32,769 for the IDT72T3695, 65,537 for the IDT72T36105, 131,073 for the IDT72T36115 and 262,145 for the IDT72T36125. 6. RCS = LOW.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
Figure 15. Read Timing (First Word Fall Through Mode)
WCLK
2 tSKEW2
(2)
tENS
tENH
1 (1) tSKEW1
WEN
tDS
tDH
D0 - Dn
WD
RCLK
1
tENS
tENS
REN
tENS
tENH
RCS
tRCSLZ tA tA W3 Wm+2 W[D-n-1] W[D-n] W[D-1] W[m+3] W[m+4] W[ W[ W[D-n+1] W[D-n+2]
D-1
tRCSHZ tA tA
D-1
tA WD tREF
Q0 - Qn
W2
W1
] ]
OR
tPAES
PAE
HF
tPAFS
tHF
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
42
tWFF
PAF
tWFF
IR
5907 drw21
NOTES: 1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that IR will go LOW after one WCLK cycle plus tWFF. If the time between the rising edge of RCLK and the rising edge of WCLK is less than tSKEW1, then the IR assertion may be delayed one extra WCLK cycle. 2. tSKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that PAF will go HIGH after one WCLK cycle plus tPAFS. If the time between the rising edge of RCLK and the rising edge of WCLK is less than tSKEW2, then the PAF deassertion may be delayed one extra WCLK cycle. 3. LD = HIGH. 4. n = PAE Offset, m = PAF offset and D = maximum FIFO depth. 5. D = 1,025 for IDT72T3645, 2,049 for IDT72T3655, 4,097 for IDT72T3665, 8,193 for IDT72T3675, 16,385 for IDT72T3685, 32,769 for the IDT72T3695, 65,537 for the IDT72T36105, 131,073 for the IDT72T36115 and 262,145 for the IDT72T36125. 6. OE = LOW.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
Figure 16. Read Cycle and Read Chip Select Timing (First Word Fall Through Mode)
RCLK
1 2 3
tENS
tENH
tENS
REN tENS tENS tENH tENS
RCS tREF tREF
OR tRCSLZ tA
W1 W2
tRCSHZ
tRCSLZ
W2
5907 drw22
HIGH-Z
Qn
1st Word falls through to O/P register on this cycle
tSKEW
WCLK tENH
tENS
WEN tDS
W2
tDS
tDH
tDH
Dn
W1
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
43
NOTES: 1. It is very important that the REN be held HIGH for at least one cycle after RCS has gone LOW. If REN goes LOW on the same cycle as RCS or earlier, then Word, W1 will be lost, Word, W2 will be read on the output when the bus goes to LOW-Z. 2. The 1st Word will fall through to the output register regardless of REN and RCS. However, subsequent reads require that both REN and RCS be active, LOW.
Figure 17 . RCS and REN Read Operation (FWFT Mode)
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
RCLK
1 2 3
tENS tENS
tENS
REN tA tA tA WMK+n WMK WMK+1 tENH tENS tENH tA WMK tENS tA WMK+1
tA
Qn
WMK-1
MARK
RT tREF tREF
EF tPAES(6)
PAE tSKEW2
1 2
WCLK tENS
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
44
tHF
WEN tPAFS
PAF
HF
5907 drw23
NOTES: 1. Retransmit setup is complete when EF returns HIGH. 2. OE = LOW;RCS = LOW. 3. RT must be HIGH when reading from FIFO. 4. Once MARK is set, the write pointer will not increment past the `marked' location, preventing overwrites of Retransmit data. 5. Before a "MARK" can be set there must be at least x number of bytes of data between the Write Pointer and Read Pointer locations. x = 32 for the IDT72T3645/72T3655/72T3665/72T3675/72T3685/72T3695, x = 128 for the IDT72T36105/72T36115, x = 256 for the IDT72T36125. Remember, 4 (x9) bytes = 2 (x18) words = 1 (x36) long word. 6. A transition in the PAE flag may occur one RCLK cycle earlier than shown, (on cycle 2).
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
Figure 18. Retransmit from Mark (IDT Standard Mode)
RCLK
1 2 3
tENS tENS
tENS
REN tA tA tA WMK WMK+1 WMK+1 WMK+n tENH tENS tENH tA tA WMK tENS tA WMK+2
tA
Qn
WMK-1
MARK
RT tREF tREF
OR tPAES(6)
PAE tSKEW2
1 2
WCLK tENS
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
45
tHF
WEN tPAFS
PAF
HF
5907 drw24
NOTES: 1. Retransmit setup is complete when OR returns LOW. 2. OE = LOW;RCS = LOW. 3. RT must be HIGH when reading from FIFO. 4. Once MARK is set, the write pointer will not increment past the `marked' location, preventing overwrites of Retransmit data. 5. Before a "MARK" can be set there must be at least x number of bytes of data between the Write Pointer and Read Pointer locations. x = 32 for the IDT72T3645/72T3655/72T3665/72T3675/72T3685/72T3695, x = 128 for the IDT72T36105/72T36115, x = 256 for the IDT72T36125. Remember, 4 (x9) bytes = 2 (x18) words = 1 (x36) long word. 6. A transition in the PAE flag may occur one RCLK cycle earlier than shown, (on cycle 2).
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
Figure 19. Retransmit from Mark (First Word Fall Through Mode)
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
tSCLK tSCKL
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
tSCKH
SCLK
tSENS tSENH tENH
SEN
tLDS tLDS tLDH
LD
tSDS tSDH
BIT X EMPTY OFFSET
(1)
SI
BIT 1
BIT 1
FULL OFFSET
BIT X
(1)
5907 drw25
NOTE: 1. X = 10 for the IDT72T3645, X = 11 for the IDT72T3655, X = 12 for the IDT72T3665, X = 13 for the IDT72T3675, X = 14 for the IDT72T3685, X = 15 for the IDT72T3695, X = 16 for the IDT72T36105, X = 17 for the IDT72T36115 and X = 18 for the IDT72T36125.
Figure 20. Serial Loading of Programmable Flag Registers (IDT Standard and FWFT Modes)
tCLK tCLKH tCLKL
WCLK
tLDS tLDH tLDH
LD
tENS tENH tENH
WEN
tDS tDH
PAE OFFSET PAF OFFSET
5907 drw26
tDH
D0 - Dn
NOTE: 1. This timing diagram illustrates programming with an input bus width of 36 bits.
Figure 21. Parallel Loading of Programmable Flag Registers (IDT Standard and FWFT Modes)
tCLK tCLKH tCLKL
RCLK
tLDS tLDH tLDS tLDH tLDS tLDH
LD
tENH tENS tENS tENH tENS tENH
REN
tA tA PAE OFFSET VALUE PAF OFFSET VALUE tA PAE OFFSET
5907 drw27
Q0 - Qn
DATA IN OUTPUT REGISTER
NOTES: 1. OE = LOW. 2. The timing diagram illustrates reading of offset registers with an output bus width of 36 bits. 3. The offset registers cannot be read on consecutive RCLK cycles. The read must be disabled (REN = HIGH) for a minimum of one RCLK cycle in between register accesses.
Figure 22. Parallel Read of Programmable Flag Registers (IDT Standard and FWFT Modes)
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
tCLKL
tCLKL 1 tENS tENH 2 1 2
WCLK WEN
tPAFS
tPAFS
D - m words in FIFO
(2)
PAF
D - (m +1) words in FIFO
(2)
D-(m+1) words (2) in FIFO
tSKEW2
(3)
RCLK
tENS tENH
5907 drw28
REN
NOTES: 1. m = PAF offset. 2. D = maximum FIFO depth. In IDT Standard mode: D = 1,024 for the IDT72T3645, 2,048 for the IDT72T3655, 4,096 for the IDT72T3665 and 8,192 for the IDT72T3675, 16,384 for the IDT72T3685, 32,768 for the IDT72T3695, 65,536 for the IDT72T36105, 131,072 for the IDT72T36115 and 262,144 for the IDT72T36125. In FWFT mode: D = 1,025 for the IDT72T3645, 2,049 for the IDT72T3655, 4,097 for the IDT72T3665, 8,193 for the IDT72T3675, 16,385 for the IDT72T3685, 32,769 for the IDT72T3695, 65,537 for the IDT72T36105, 131,073 for the IDT72T36115 and 262,145 for the IDT72T36125. 3. tSKEW2 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that PAF will go HIGH (after one WCLK cycle plus tPAFS). If the time between the rising edge of RCLK and the rising edge of WCLK is less than tSKEW2, then the PAF deassertion time may be delayed one extra WCLK cycle. 4. PAF is asserted and updated on the rising edge of WCLK only. 5. Select this mode by setting PFM HIGH during Master Reset.
Figure 23. Synchronous Programmable Almost-Full Flag Timing (IDT Standard and FWFT Modes)
tCLKH
tCLKL
WCLK
tENS tENH
WEN PAE
n words in FIFO , (3) n + 1 words in FIFO
(2)
tSKEW2
(4)
tPAES 2 tENS
n + 1 words in FIFO , (3) n + 2 words in FIFO
(2)
n words in FIFO , (3) n + 1 words in FIFO
(2)
tPAES 1 2
RCLK REN
1
tENH
5907 drw29
NOTES: 1. n = PAE offset. 2. For IDT Standard mode 3. For FWFT mode. 4. tSKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that PAE will go HIGH (after one RCLK cycle plus tPAES). If the time between the rising edge of WCLK and the rising edge of RCLK is less than tSKEW2, then the PAE deassertion may be delayed one extra RCLK cycle. 5. PAE is asserted and updated on the rising edge of WCLK only. 6. Select this mode by setting PFM HIGH during Master Reset. 7. RCS = LOW.
Figure 24. Synchronous Programmable Almost-Empty Flag Timing (IDT Standard and FWFT Modes)
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
tCLKH WCLK tENS WEN tPAFA PAF D - (m + 1) words in FIFO D - m words in FIFO tPAFA RCLK tENS REN tENH tCLKL
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
D - (m + 1) words in FIFO
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NOTES: 1. m = PAF offset. 2. D = maximum FIFO Depth. In IDT Standard Mode: D=1,024 for the IDT72T3645, 2,048 for the IDT72T3655, 4,096 for the IDT72T3665, 8,192 for the IDT72T3675, 16,384 for the IDT72T3685, 32,768 for the IDT72T3695, 65,536 for the IDT72T36105, 131,072 for the IDT72T36115 and 262,144 for the IDT72T36125. In FWFT Mode: D=1,025 for the IDT72T3645, 2,049 for the IDT72T3655, 4,097 for the IDT72T3665, 8,193 for the IDT72T3675, 16,385 for the IDT72T3685, 32,769 for the IDT72T3695, 65,537 for the IDT72T36105, 131,073 for the IDT72T36115 and 262,145 for the IDT72T36125. 3. PAF is asserted to LOW on WCLK transition and reset to HIGH on RCLK transition. 4. Select this mode by setting PFM LOW during Master Reset. 5. RCS = LOW.
Figure 25. Asynchronous Programmable Almost-Full Flag Timing (IDT Standard and FWFT Modes)
tCLKH WCLK
tCLKL
tENS WEN
tENH
PAE
n words in FIFO(2), n + 1 words in FIFO(3)
tPAEA
n + 1 words in FIFO(2), n + 2 words in FIFO(3)
n words in FIFO(2), n + 1 words in FIFO(3)
tPAEA RCLK tENS REN
5907 drw31
NOTES: 1. n = PAE offset. 2. For IDT Standard Mode. 3. For FWFT Mode. 4. PAE is asserted LOW on RCLK transition and reset to HIGH on WCLK transition. 5. Select this mode by setting PFM LOW during Master Reset. 6. RCS = LOW.
Figure 26. Asynchronous Programmable Almost-Empty Flag Timing (IDT Standard and FWFT Modes)
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IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
tCLKH WCLK tENS WEN tHF HF
D/2 words in FIFO(1), D-1 (2) 2 + 1] words in FIFO
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
tCLKL tENH
[
[ D-1+ 2] words in FIFO(2) 2
tHF
D/2 + 1 words in FIFO(1),
[
D/2 words in FIFO(1), D-1 (2) 2 + 1] words in FIFO
RCLK tENS REN
5907 drw32
NOTES: 1. In IDT Standard mode: D = maximum FIFO depth. D = 1,024 for the IDT72T3645, 2,048 for the IDT72T3655, 4,096 for the IDT72T3665, 8,192 for the IDT72T3675, 16,384 for the IDT72T3685, 32,768 for the IDT72T3695, 65,536 for the IDT72T36105, 131,072 for the IDT72T36115 and 262,144 for the IDT72T36125. 2. In FWFT mode: D = maximum FIFO depth. D = 1,025 for the IDT72T3645, 2,049 for the IDT72T3655, 4,097 for the IDT72T3665, 8,193 for the IDT72T3675, 16,385 for the IDT72T3685, 32,769 for the IDT72T3695, 65,537 for the IDT72T36105, 131,073 for the IDT72T36115 and 262,145 for the IDT72T36125. 3. RCS = LOW.
Figure 27. Half-Full Flag Timing (IDT Standard and FWFT Modes)
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RCLK
tERCLK
ERCLK tENH tENS
REN tENS
tENS
tENH
RCS tCLKEN tCLKEN tCLKEN tCLKEN tCLKEN
tCLKEN
EREN tREF
EF tOHZ tA tA tOLZ tA
tA
Qn
tOLZ
WD-3 WD-3
WD-2
WD-1
Last Word, WD
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WD-4
NOTES: 1. The EREN output is an "ANDed" function of RCS and REN and will follow these inputs provided that the FIFO is not empty. If the FIFO is empty, EREN will go HIGH, thus preventing any reads. 2. The EREN output is synchronous to RCLK.
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
50
Figure 28. Echo Read Clock & Read Enable Operation (IDT Standard Mode Only)
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
WCLK tENS WEN tDS D0 - Dn tDH tDS tDH tDS tDH tENH
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
Wn+1
Wn+2 tSKEW1
1
Wn+3
2 b c d e f g h i
RCLK tERCLK ERCLK
a
REN tENS RCS tCLKEN EREN tCLKEN
tENS
tENH
tCLKEN
tCLKEN
tRCSLZ Qn
HIGH-Z
tA Wn+2
tA Wn+3 tREF
Wn+1 tREF
OR tA O/P Reg. Wn Last Word Wn+1 tA Wn+2 tA Wn+3
5907 drw34
NOTE: 1. The O/P Register is the internal output register. Its contents are available on the Qn output bus only when RCS and OE are both active, LOW, that is the bus is not in HighImpedance state. 2. OE is LOW. Cycle: a&b. At this point the FIFO is empty, OR is HIGH. RCS and REN are both disabled, the output bus is High-Impedance. c. Word Wn+1 falls through to the output register, OR goes active, LOW. RCS is HIGH, therefore the Qn outputs are High-Impedance. EREN goes LOW to indicate that a new word has been placed on the output register. d. EREN goes HIGH, no new word has been placed on the output register on this cycle. e. No Operation. f. RCS is LOW on this cycle, therefore the Qn outputs go to Low-Impedance and the contents of the output register (Wn+1) are made available. NOTE: In FWFT mode is important to take RCS active LOW at least one cycle ahead of REN, this ensures the word (Wn+1) currently in the output register is made available for at least one cycle. g. REN goes active LOW, this reads out the second word, Wn+2. EREN goes active LOW to indicate a new word has been placed into the output register. h. Word Wn+3 is read out, EREN remains active, LOW indicating a new word has been read out. NOTE: Wn+3 is the last word in the FIFO. i. This is the next enabled read after the last word, Wn+3 has been read out. OR flag goes HIGH and EREN goes HIGH to indicate that there is no new word available.
Figure 29. Echo RCLK and Echo REN Operation (FWFT Mode Only)
51
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
RCLK REN tENS tENH tA Qn FF tFFA WR tDS Dn tDH WD WD+1
5907 drw35
W0 tFFA tCYC tFFA tCYH
W1
NOTE: 1. OE = LOW, WEN = LOW and RCS = LOW.
Figure 30. Asynchronous Write, Synchronous Read, Full Flag Operation (IDT Standard Mode)
RCLK REN Qn EF
tSKEW
1
2
tENS tA Last Word tREF tCYL W0
tENH tA W1 tREF
WR
tDS
tCYH tCYC tDH W0 tDS W1
5907 drw36
tDH
Dn
NOTE: 1. OE = LOW, WEN = LOW and RCS = LOW.
Figure 31. Asynchronous Write, Synchronous Read, Empty Flag Operation (IDT Standard Mode)
52
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
No Write
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
WCLK WEN Dn
1
2
DF tWFF
DF+1 tWFF
FF tSKEW RD tAA Qn Last Word WX tAA WX+1
5907 drw37
tCYC tCYL tCYH
NOTE: 1. OE = LOW, RCS = LOW and REN = LOW. 2. Asynchronous Read is available in IDT Standard Mode only.
Figure 32. Synchronous Write, Asynchronous Read, Full Flag Operation (IDT Standard Mode)
WCLK tENS WEN tDS Dn W0 tEFA tRPE RD tAA Qn Last Word in Output Register W0
5907 drw38
tENH
tDH
EF
tEFA tCYH
NOTE: 1. OE = LOW, REN = LOW and RCS = LOW. 2. Asynchronous Read is available in IDT Standard Mode only.
Figure 33. Synchronous Write, Asynchronous Read, Empty Flag Operation (IDT Standard Mode)
53
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
tCYH
WR
tCYC
tCYL tDS
W1
tDH
Dn W0
tDH
RD
tAA
Qn Last Word in O/P Register W0
tAA
W1
tEFA
EF
tRPE
tEFA
5907 drw39
NOTES: 1. OE = LOW, WEN = LOW, REN = LOW and RCS = LOW 2. Asynchronous Read is available in IDT Standard Mode only.
Figure 34. Asynchronous Write, Asynchronous Read, Empty Flag Operation (IDT Standard Mode)
tCYC tCYH WR tDS Dn tCYC tCYH RD tAA Qn Wx tFFA FF
5907 drw40
tCYL
tDH Wy
tDS Wy+1
tDH
tCYL tAA Wx+1 Wx+2 tFFA
NOTES: 1. OE = LOW, WEN = LOW, REN = LOW and RCS = LOW. 2. Asynchronous Read is available in IDT Standard Mode only.
Figure 35. Asynchronous Write, Asynchronous Read, Full Flag Operation (IDT Standard Mode)
54
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
OPTIONAL CONFIGURATIONS
WIDTH EXPANSION CONFIGURATION Word width may be increased simply by connecting together the control signals of multiple devices. Status flags can be detected from any one device. The exceptions are the EF and FF functions in IDT Standard mode and the IR and OR functions in FWFT mode. Because of variations in skew between RCLK and WCLK, it is possible for EF/FF deassertion and IR/OR assertion to vary by one cycle between FIFOs. In IDT Standard mode, such problems can be avoided by creating composite flags, that is, ANDing EF of every FIFO, and
separately ANDing FF of every FIFO. In FWFT mode, composite flags can be created by ORing OR of every FIFO, and separately ORing IR of every FIFO. Figure 36 demonstrates a width expansion using two IDT72T3645/ 72T3655/72T3665/72T3675/72T3685/72T3695/72T36105/72T36115/ 72T36125 devices. D0 - D35 from each device form a 72-bit wide input bus and Q0-Q35 from each device form a 72-bit wide output bus. Any word width can be attained by adding additional IDT72T3645/72T3655/72T3665/72T3675/ 72T3685/72T3695/72T36105/72T36115/72T36125 devices.
SERIAL CLOCK (SCLK) PARTIAL RESET (PRS) MASTER RESET (MRS) FIRST WORD FALL THROUGH/ SERIAL INPUT (FWFT/SI) RETRANSMIT (RT) Dm+1 - Dn m+n DATA IN D0 - Dm
m
n
IDT 72T3645 72T3655 72T3665 72T3675 72T3685 72T3695 72T36105 72T36115 72T36125 READ CLOCK (RCLK) READ CHIP SELECT (RCS) READ ENABLE (REN) OUTPUT ENABLE (OE) PROGRAMMABLE (PAE) EMPTY FLAG/OUTPUT READY (EF/OR) #1 EMPTY FLAG/OUTPUT READY (EF/OR) #2
WRITE CLOCK (WCLK) WRITE ENABLE (WEN) LOAD (LD) FULL FLAG/INPUT READY (FF/IR) #1
(1)
GATE
FULL FLAG/INPUT READY (FF/IR) #2 PROGRAMMABLE (PAF) HALF-FULL FLAG (HF)
IDT 72T3645 72T3655 72T3665 72T3675 72T3685 72T3695 72T36105 72T36115 72T36125 FIFO #1
(1)
GATE
m
FIFO #2
n
Q - Qn m+1
m+n DATA OUT
Q0 - Qm
5907 drw41
NOTES: 1. Use an AND gate in IDT Standard mode, an OR gate in FWFT mode. 2. Do not connect any output control signals directly together. 3. FIFO #1 and FIFO #2 must be the same depth, but may be different word widths.
Figure 36. Block Diagram of 1,024 x 72, 2,048 x 72, 4,096 x 72, 8,192 x 72, 16,384 x 72, 32,768 x 72, 65,536 x 72, 131,072 x 72 and 262,144 x 72 Width Expansion
55
IDT72T3645/55/65/75/85/95/105/115/125 2.5V TeraSync 36-BIT FIFO 1K x 36, 2K x 36, 4K x 36, 8K x 36, 16K x 36, 32K x 36, 64K x 36, 128K x 36 and 256K x 36
FWFT/SI TRANSFER CLOCK WRITE CLOCK WRITE ENABLE INPUT READY FWFT/SI WCLK IDT WEN IR RCLK
WCLK
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
FWFT/SI
RCLK
READ CLOCK READ CHIP SELECT READ ENABLE OUTPUT READY OUTPUT ENABLE n DATA OUT
5907 drw42
IDT OR REN RCS OE Qn GND n
WEN IR
DATA IN
n Dn
72T3645 72T3655 72T3665 72T3675 72T3685 72T3695 72T36105 72T36115 72T36125
Dn
72T3645 72T3655 72T3665 72T3675 72T3685 72T3695 72T36105 72T36115 72T36125
RCS REN OR OE
Qn
Figure 37. Block Diagram of 2,048 x 36, 4,096 x 36, 8,192 x 36, 16,384 x 36, 32,768 x 36, 65,536 x 36, 131,072 x 36, 262,144 x 36 and 524,288 x 36 Depth Expansion DEPTH EXPANSION CONFIGURATION (FWFT MODE ONLY) The IDT72T3645 can easily be adapted to applications requiring depths greater than 1,024, 2,048 for the IDT72T3655, 4,096 for the IDT72T3665, 8,192 for the IDT72T3675, 16,384 for the IDT72T3685, 32,768 for the IDT72T3695, 65,536 for the IDT72T36105, 131,072 for the IDT72T36115 and 262,144 for the IDT72T36125 with an 18-bit bus width. In FWFT mode, the FIFOs can be connected in series (the data outputs of one FIFO connected to the data inputs of the next) with no external logic necessary. The resulting configuration provides a total depth equivalent to the sum of the depths associated with each single FIFO. Figure 37 shows a depth expansion using two IDT72T3645/72T3655/72T3665/72T3675/72T3685/72T3695/ 72T36105/72T36115/72T36125 devices. Care should be taken to select FWFT mode during Master Reset for all FIFOs in the depth expansion configuration. The first word written to an empty configuration will pass from one FIFO to the next ("ripple down") until it finally appears at the outputs of the last FIFO in the chain - no read operation is necessary but the RCLK of each FIFO must be free-running. Each time the data word appears at the outputs of one FIFO, that device's OR line goes LOW, enabling a write to the next FIFO in line. For an empty expansion configuration, the amount of time it takes for OR of the last FIFO in the chain to go LOW (i.e. valid data to appear on the last FIFO's outputs) after a word has been written to the first FIFO is the sum of the delays for each individual FIFO: (N - 1)*(4*transfer clock) + 3*TRCLK where N is the number of FIFOs in the expansion and TRCLK is the RCLK period. Note that extra cycles should be added for the possibility that the tSKEW1 specification is not met between WCLK and transfer clock, or RCLK and transfer clock, for the OR flag. The "ripple down" delay is only noticeable for the first word written to an empty depth expansion configuration. There will be no delay evident for subsequent words written to the configuration. The first free location created by reading from a full depth expansion configuration will "bubble up" from the last FIFO to the previous one until it finally moves into the first FIFO of the chain. Each time a free location is created in one FIFO of the chain, that FIFO's IR line goes LOW, enabling the preceding FIFO to write a word to fill it. For a full expansion configuration, the amount of time it takes for IR of the first FIFO in the chain to go LOW after a word has been read from the last FIFO is the sum of the delays for each individual FIFO: (N - 1)*(3*transfer clock) + 2 TWCLK where N is the number of FIFOs in the expansion and TWCLK is the WCLK period. Note that extra cycles should be added for the possibility that the tSKEW1 specification is not met between RCLK and transfer clock, or WCLK and transfer clock, for the IR flag. The Transfer Clock line should be tied to either WCLK or RCLK, whichever is faster. Both these actions result in data moving, as quickly as possible, to the end of the chain and free locations to the beginning of the chain.
56
ORDERING INFORMATION
IDT XXXXX Device Type X Power XX Speed X Package X Process / Temperature Range BLANK I(1) BB BB Commercial (0C to +70C) Industrial (-40C to +85C) Plastic Ball Grid Array, PBGA BB208-1 (72T3645/55/65/75/85/95 Only) Plastic Ball Grid Array, PBGA BB240-1 (72T36105/115/125 Only)
4-4 5 6-7 10 L 72T3645 72T3655 72T3665 72T3675 72T3685 72T3695 72T36105 72T36115 72T36125
Commercial Only Commercial and Industrial Commercial Only Commercial Only Low Power 1,024 x 36 2,048 x 36 4,096 x 36 8,192 x 36 16,384 x 36 32,768 x 36 65,536 x 36 131,072 x 36 262,144 x 36
Clock Cycle Time (tCLK) Speed in Nanoseconds
2.5V TeraSync 2.5V TeraSync 2.5V TeraSync 2.5V TeraSync 2.5V TeraSync 2.5V TeraSync 2.5V TeraSync 2.5V TeraSync 2.5V TeraSync
FIFO FIFO FIFO FIFO FIFO FIFO FIFO FIFO FIFO
5907 drw43
NOTE: 1. Industrial temperature range product for 5ns speed is available as a standard device. All other speed grades are available by special order.
DATASHEET DOCUMENT HISTORY
05/30/2001 07/09/2001 09/07/2001 09/11/2001 11/19/2001 11/29/2001 01/15/2002 03/04/2002 06/05/2002 02/11/2003 03/03/2003 09/02/2003 pgs. 17, and 18. pgs. 1, 7, 8, 19, and 51. pgs. 1-53. pg. 8. pgs. 1, 9, 12, 40, and 41. pgs. 1, 40, and 41. pg. 42. pgs. 9, 10, and 29. pgs. 9, 10, and 14. pgs. 8, 9, and 33. pgs. 1, 11-13, 31, and 33-35. pgs. 7, 17, and 26. CORPORATE HEADQUARTERS 2975 Stender Way Santa Clara, CA 95054 for SALES: 800-345-7015 or 408-727-6116 fax: 408-492-8674 www.idt.com
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for Tech Support: 408-330-1753 email: FIFOhelp@idt.com

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